| With the development of electronic packaging technology, the traditional bonding gold wire is losing the advantage, due to its low performance and high price. The substitute products have been developed by compounding and modifying the existing bonding gold wire, in order to meet new requirements. The present article summarized the performance feature, composition, key preparative technology of four substitute products. They are Au-coated Ag composite bonding wires, Pd-coated Cu composite bonding wire, Au alloy bonding wire and Ag alloy bonding wire. Some typical products were presented, and the future development was prospected. |
