文章摘要
二氧化硅表面化学镀银研究
Study on silver plating on the surface of silicon dioxide
投稿时间:2021-02-03  
DOI:
中文关键词: 二氧化硅  硅烷偶联剂改性  化学镀银  导电性能
英文关键词: SiO2  silane coupling agent modification  electroless silver plating  conductivity
基金项目:湖北省教育厅科学研究项目(B2020198);荆楚理工学院科研项目(ZD202106);荆门市科技局项目(2018YFYB048);荆楚理工学院教育教学研究项目(JX2018-024);湖北省大学生创新创业训练项目(202011336022/202011336023);荆楚理工学院大学生创新创业训练项目(KC2021029)
作者单位
陈勇 荆楚理工学院 化工与药学院湖北 荆门 448000
荆门化工绿色技术研究院湖北 荆门 448000 
吴明阳 荆楚理工学院 化工与药学院湖北 荆门 448000 
谭晓明 荆楚理工学院 化工与药学院湖北 荆门 448000 
熊航行 荆楚理工学院 化工与药学院湖北 荆门 448000 
冯靖 荆楚理工学院 化工与药学院湖北 荆门 448000 
朱琼 湖北本心环保科技有限公司武汉 430074 
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中文摘要:
      通过二氧化硅(SiO2)表面硅烷偶联剂改性,继续以聚甲基吡咯烷酮(PVP)为稳定剂,银氨溶液为银源,葡萄糖与甲醛为二元还原剂,对SiO2表面化学镀银工艺进行了研究。最佳镀银工艺条件为:当AgNO3/SiO2质量比为1:1,葡萄糖浓度为0.1 g/mL,反应温度为30℃,反应溶液pH值为13.5,能够获得较高导电率的SiO2镀银(SiO2-Ag)复合粒子,最高导电率为2564 S/cm。使用红外光谱、X射线衍射、热重分析和偏光显微镜等表征产物的物化性能,结果表明:PVP参与化学镀银反应,使SiO2-Ag的热失重变大。基于实验结果探讨了二氧化硅化学镀银的反应机理。
英文摘要:
      Silicon dioxide (SiO2) surface was modified by silane coupling agent, then the electroless silver plating process was studied with polymethylpyrrolidone (PVP) as stabilizer, silver ammonia solution as silver source, glucose and formaldehyde as binary reducing agent. The optimal silver plating process conditions were obtained as follows: the mass ratio of AgNO3/SiO2 was 1:1, the concentration of glucose was 0.1 g/mL, the reaction temperature was 30℃ and the pH value of the reaction solution was 13.5. The results showed that SiO2-Ag composite particles can be obtained with the highest conductivity 2564 S/cm. The physicochemical properties of SiO2-Ag were characterized by infrared spectrometer, X-ray diffractometer, thermogravimetry and polarizing microscope, and the results showed that PVP participated in the electroless silver plating reaction, which made the thermogravimetry of SiO2-Ag increased. The mechanism of electroless silver plating on SiO2 was discussed based on the experimental results.
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