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| 铜/银合金纳米粒子的制备及表征 |
| Preparation and Characterization of Copper/Silver Alloy Nanoparticles |
| 投稿时间：2013-09-12 |
| DOI： |
| 中文关键词: 物理化学 铜/银合金 纳米粒子 印制电路 制备 |
| 英文关键词: physical chemistry copper/silver alloy nanoparticles printed circuits preparation |
| 基金项目:国家自然科学基金(No.21173087, No.51273070 )、中央高校项目(No.2014ZM0058)。 |
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| 中文摘要: |
| 研究了铜/银合金纳米粒子的制备方法，用抗坏血酸做还原剂，制备了粒径小的纳米铜粉。由于纳米铜粉的稳定性差，易氧化，为了提高其稳定性，在制备的纳米铜粉中加了少量的Ag+，在纳米铜粉表面还原制备出银纳米层覆盖于在铜上。所制备的纳米铜/银合金纳米粒子稳定性好，具有纳米粒子的效应，有望应用于印制电路的制造。该制备方法可以减少传统印制电路板制作方法的工序，节约资源，且减少对环境的污染。 |
| 英文摘要: |
| The preparation method of copper/silver alloy nanoparticles was studied. The small particle size of nano copper was prepared by using the environmentally friendly ascorbic acid as a reducing agent. But this nano copper had poor stability, and is easy to be oxidized. In order to improve its stability, a small amount of Ag+ was added during the preparation of nano copper. The silver layer was covered on the nano copper surface by reduction reaction. The copper/silver alloy nanocrystalline possesses good stability and nanoparticles effect. The copper/silver alloy nanoparticles are expected to having potential application in production of printed circuits. The preparation method has shorter product process than the conventional PCB production, thus it can save resources and reduce the environmental pollution. |
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