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| 热处理对片状银粉微观结构的影响 |
| Effect of Annealing on the Microstructure of Silver Flakes |
| 投稿时间：2014-08-21 |
| DOI： |
| 中文关键词: 金属材料 片状银粉 球磨 热处理 晶体缺陷 |
| 英文关键词: metal materials silver flakes ball milling annealing crystal defects |
| 基金项目: |
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| 中文摘要: |
| 通过高能球磨制备的片状银粉将产生大量的晶体缺陷，这些缺陷的存在将影响银粉的导电性能。对高能球磨制得的片状银粉进行了热处理研究，以减少或消除片状银粉内部的晶体缺陷，改善其微观组织，提高银粉的导电性。结果表明，热处理使塑性形变后的银粉发生回复和再结晶，晶格畸变和晶体缺陷明显减少或者部分去除。 |
| 英文摘要: |
| Silver flakes made by ball milling contain large quantities of crystal defects that have negative influences on the electric conductivity of silver powders. To decrease crystal defects, ameliorate the microstructure and improve the electric conductivity, an appropriate heat treatment was established in our work. The results indicated that annealing could make milled silver flakes recover and re-crystallize, resulting in the decrease and even elimination of these lattice distortion and crystal defects. |
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