| To prepare a high-temperature-resistant conductive adhesive, flake silver powder was selected as the conductive filler, phenolic resin as the matrix resin, and hexamethylenetetramine as the curing agent. The relationships among the volume resistivity and the curing time, the curing temperature, the amount of curing agent, and the amount of silver powder were discussed, and the optimum formula was defined. The best dispersant was chosen by the method of SEM, and the initial decomposition temperature of 366℃ was obtained from TG/DSC. The heat resistant of the conductive adhesive thus prepared was excellent. |
