|
| 微电子封装银合金键合线的研究及发展前景 |
| Research and Development Prospect of Ag Alloy Bonding Wire in Microelectronic Packaging |
| 投稿时间：2017-06-26 |
| DOI： |
| 中文关键词: 微电子封装 键合引线 银合金线 集成电路(IC)封装 发展前景 |
| 英文关键词: electronic packaging bonding wire Ag alloy bonding wire IC packaging development prospect |
| 基金项目:河南省科技攻关项目(2GSO64-A52-05)。 |
|
| 摘要点击次数: 2504 |
| 全文下载次数: 3355 |
| 中文摘要: |
| 论述了微电子封装中常用的键合金线、键合铜线和键合银线的局限性，从机械性能、键合性能、可靠性等方面分析了键合银合金线的特征及作为键合引线的优势，并在此基础上阐述了键合银合金线重点研究方向以及在未来集成电路封装中的发展前景。 |
| 英文摘要: |
| The limitations of Au bonding wire, Cu bonding wire and Ag bonding wire, which are commonly used in microelectronic packaging, were discussed. The excellent mechanical properties, bonding properties and high reliability of bonding Ag alloy wire were analyzed. And the research direction and development prospect of Ag alloy wire as bonding wire in the future IC packaging were described. |
|
查看全文
查看/发表评论 下载PDF阅读器 |
| 关闭 |
