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| 玻璃粉对低温共烧用通孔银浆性能的影响 |
| The Influence of Glass Powder on Silver via Fill Paste Properties for LTCC |
| 投稿时间：2018-03-13 |
| DOI： |
| 中文关键词: 金属材料 低温共烧陶瓷 通孔银浆 性能 凹陷 |
| 英文关键词: metal material LTCC silver via fill paste property sunken |
| 基金项目:云南省青年基金(2017FD214)；云南省科技强省计划(2016020201)。 |
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| 中文摘要: |
| 通孔银浆实现了LTCC不同电路层间的电学导通和元件散热，是低温共烧陶瓷元件经常使用的一种浆料。通过研究浆料组分中玻璃粉的软化点、添加量对通孔银浆印刷填孔工艺、电学性能、匹配性以及基板可靠性的影响，制备出一款匹配Ferro A6瓷料使用的通孔银浆，并进一步揭示玻璃粉对浆料印刷填孔和与瓷料共烧影响的一些内在机理，对其他相关类型浆料和瓷料的研制和使用有一些指导意义。 |
| 英文摘要: |
| Silver via fill paste is one of the pastes which are often used in low-temperature co-fired ceramic components. It realizes electrical, realizes electrical interconnection and heat dissipation between different circuit layers of LTCC. By optimizing the softening point of inorganic frits, glass powder ratio in silver via fill pastes, electrical properties, matching properties and substrate reliability, obtained a sliver via fill paste which is suitable for Ferro A6 green tape. The intrinsic mechanisms of glass powder on the effect of film printing hole filling and co-firing with ceramic were explored. This research provides reference for the development and applications of via fill paste for related multilayer co-fired ceramic. |
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