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| 电子行业用高纯金溅射靶材研究综述 |
| Review on Study of High Purity Gold Sputtering Target Material Used in Electronics Industry |
| 投稿时间：2018-11-21 |
| DOI： |
| 中文关键词: 金属材料 半导体集成电路 高纯金 溅射靶材 |
| 英文关键词: metal materials semiconductor integrated circuit high purity gold sputtering target |
| 基金项目:云南省重点研发计划科技入滇专项项目(2017IB016) |
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| 中文摘要: |
| 围绕半导体集成电路产业的需求，综述高纯金提纯中杂质元素的控制，制备工艺中的金靶材结构设计、微结构调控技术及靶材与背板焊接绑定等技术的研究现状。提出通过行业协调修订相关产品标准，结合溅射设备完善靶材的结构设计，开展靶材微结构调控进行金薄膜与靶材结构的关联性研究，拓展高纯金靶材的绑定技术等研究方向。 |
| 英文摘要: |
| Based on the technical requirements of semiconductor integrated circuit industry, the recent research status of gold sputtering target is reviewed. The related techniques, including the control of impurity elements in the high-pure gold refining and the structure design of gold target and the microstructure regulation are discussed along with the bonding method of target to back plate. New developments are proposed. They are (1) structure design of target on account of sputtering equipment, (2) establishment of the correlationship between the target structure and gold film, and (3) expansion of the research field into the bonding technology of high-pure gold target. Coordination and revision of the relevant product standards in the industry are also suggested. |
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