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| AgSnO2/Cu材料焊接钎着率及界面的组织研究 |
| Study on the Brazing Rate and Interface Microstructure of AgSnO2/Cu Material |
| 投稿时间：2020-09-18 |
| DOI： |
| 中文关键词: 复合材料 AgSnO2电接触材料 钎着率 组织形貌 焊接 |
| 英文关键词: composites AgSnO2 electrical contact material brazing structure and morphology welding |
| 基金项目:国家重点研发计划(2017YFB0305700)；国家自然科学基金(NSFC-云南联合基金) (U1602271, U1602275)；云南省稀贵金属材料基因工程(202002AB080001-1) |
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| 中文摘要: |
| 以AgSnO2电接触复合材料为触点材料、紫铜为底板、银铜锌为钎料，通过火焰焊接实现触头和底板的联接。采用超声波成像无损探伤检测仪、金相显微镜、扫描电子显微镜(SEM)等测试手段，研究焊料及焊缝的显微组织形貌对钎着率的影响。结果表明，在焊接过程中触头材料会出现气孔、裂纹、夹杂等微观缺陷，该缺陷主要存在于铜与AgSnO2的结合界面层，采用AgCuZn作为钎焊材料，结合界面具有良好的焊接性能。 |
| 英文摘要: |
| The AgCuZn solder was used to weld the AgSnO2 electrical contact composite material and red copper by flame welding. Ultrasonic scan machine, metalloscope and scanning electron microscope (SEM) were applied to investigate the effects of solder and weld microstructures on brazing rate. The research results show that microscopic defects such as pores, cracks and inclusions appear in the contact material during the welding process. The defects mainly exist in the bonding interface layer of copper and AgSnO2. The bonding interface has great welding performance with AgCuZn as the solder. |
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