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| 高温钎料焊膏研究进展 |
| Research Progress on High Temperature Solder Paste |
| 投稿时间：2020-07-16 |
| DOI： |
| 中文关键词: 焊膏 镍基钎料 铜基钎料 银基钎料 |
| 英文关键词: solder paste nickel base solder copper base solder silver base solder |
| 基金项目:陕西省重点研发计划项目(2019GY-158)；国家重点研发计划(2017YFB0305702) |
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| 中文摘要: |
| 针对高温钎料使用便利性的需求，综述了高温钎料焊膏的相关研究现状。介绍了焊膏各组分在焊膏制备和钎焊中的作用，阐述了镍基、铜基、银基、钛基和金基五种常用高温钎料及其焊膏的应用与发展趋势，为高性能高温钎料焊膏的开发提供了参考。 |
| 英文摘要: |
| The research status of high temperature solder paste was reviewed for the convenience of high temperature solder. The effect of each component on the preparation and brazing of solder paste was introduced. Mean while, the application and development trend of five commonly high-temperature solders including nickel base, copper base, silver base, titanium base and gold base were described. It provided a reference for the development of excellent high temperature solder paste. |
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