文章摘要
一种电子元器件银浆用玻璃粉的研制
Development of Silver Glass Powder for Electronic Components Silver Paste
投稿时间:2020-07-05  
DOI:
中文关键词: 金属材料  银浆  性能  玻璃粉  附着力
英文关键词: metal materials  silver paste  performance  glass powder  adhesion
基金项目:
作者单位E-mail
王靖 西安创联宏晟电子有限公司西安 710065  
李宏杰 西安创联宏晟电子有限公司西安 710065 hongjie.li2007@163.com 
冀亮君 西安创联宏晟电子有限公司西安 710065  
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中文摘要:
      不同基体的银浆需要采用不同成分的玻璃粉才能达到合适的性能。采用Bi2O3-SiO2-B2O3体系,研究了Ag2O对Zn2SiO4介质陶瓷附着力的影响。当Bi2O3含量(质量分数)为65%,SiO2含量为15%,B2O3含量为10%,Ag2O含量为5%,Al2O3含量为5%时,制备的银浆附着力≥20N;所得银浆料的印刷性能、方阻、附着力、与焊料的润湿性及耐焊性等各项指标符合要求。
英文摘要:
      Silver paste with different substrates, the glass powder with different composition is needed. The material system Bi2O3-SiO2-B2O3 is used to study the effect Ag2O on the adhesion of Zn2SiO4 dielectric ceramics. When the content (mass fraction) of Bi2O3 is 65%, SiO2 is 15%, B2O3 is 10%, Ag2O is 5%, and Al2O3 is 5%, the prepared silver paste adhesion is larger than≥20N. All the indexes of the silver paste, such as printing performance, square resistance, adhesion, wettability and solder resistance, can meet the requirements index.
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