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| 硫脲浸金电化学行为研究 |
| Study on the electrochemical behavior of thiourea leaching gold |
| 投稿时间：2020-04-26 |
| DOI： |
| 中文关键词: 硫脲 浸金 Fe3+浓度 电化学 腐蚀性能 |
| 英文关键词: thiourea gold leaching Fe3 + concentration electrochemistry corrosion properties |
| 基金项目:国家自然科学基金项目(51764024)；云南教育厅科学研究基金(2021J1374) |
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| 中文摘要: |
| 采用循环伏安法(CV)、Tafel曲线和差分脉冲伏安法(DPV)等电化学方法对模拟硫脲浸金体系进行了研究。结果表明，硫脲浓度范围为0.005~0.04 mol/L，浓度增大有利于金的浸出；在Fe3+浓度为0.01~0.08 mol/L范围内，随着Fe3+浓度的增大，金腐蚀电位负移，腐蚀电流变大；适度升温可以提高金的腐蚀。实际矿物浸出验证试验表明，金的浸出率随Fe3+浓度(0.02~0.08 mol/L)增大而增大，最高达到了53.21%；金的浸出率随硫脲浓度(0.005~0.05 mol/L)增大而增大，最高达到了78.67%，与电化学分析结论基本一致。 |
| 英文摘要: |
| Cyclic voltammetry, Tafel curve and differential pulsed voltammetry were used to analyze and simulate thiourea gold leaching system. The results showed that the increase of thiourea concentration was beneficial to gold leaching in the concentration range of 0.005 to 0.04 mol/L. The gold corrosion potential shifted to negative direction and the corrosion current increased with iron concentration in the range of 0.01~0.08 mol/L of iron concentration. A moderate increase in temperature can increase gold corrosion. The actual mineral leaching verification experiments showed that under certain external conditions, the gold leaching rate increased with iron concentration in the range of 0.02 to 0.08 mol/L, reaching a maximum of 53.21%. The leaching rate of gold increased with thiourea concentration (0.005~ 0.05 mol/L), reaching a maximum of 78.67%. This is basically consistent with the conclusion of electrochemical analysis. |
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