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| 键合丝最小直流熔断电流的建模与分析 |
| Modeling and analysis of minimum DC fusing current of bonding wire |
| 投稿时间：2022-02-17 |
| DOI： |
| 中文关键词: 金属材料 半导体封装 键合丝 熔断电流 有限元 |
| 英文关键词: metallic material semiconductor package bonding wire fusing current finite element |
| 基金项目:陕西省“十三五”教育科学规划2020年度课题(SGH20Y1380)；陕西省“十四五”教育科学规划2022年度课题(SGH22Y1722)；西安交通大学城市学院校内科研基金项目(2020Y14) |
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| 中文摘要: |
| 半导体产品的高可靠性要求作为内部引线的键合丝有足够大的电流承载能力。本文建立了键合丝最小直流熔断电流的理论模型和公式，用COMSOL Multiphysics有限元软件建立键合丝的电热耦合仿真模型，并与理论模型进行了对比。结果表明，键合丝工作时中间温度最高，两端温度最低，温度分布沿轴向及径向均呈抛物线状分布。金、铜和银三种键合丝的熔断电流仿真值与实验值符合得较好，理论值比实验值偏小，但其乘以相应系数后可接近于实际工况。该理论仿真模型可为键合丝熔断电流的分析提供参考。 |
| 英文摘要: |
| A large enough current carrying capacity of the bonding wire as the internal lead is required for the high reliability of semiconductor products. The theoretical model and formula of minimum DC fusing current of the bonding wire were established in this paper. The electric-thermal coupling simulation model was obtained by using the finite element software COMSOL Multiphysics, and then compared with the theoretical model. The results show that the temperature of the bonding wire is the highest in the middle and the lowest at both ends, and the axial and radial temperature distribution are both parabolic. The simulation values are in good agreement with the experimental values for gold, copper, and silver bonding wires, but the theoretical values are smaller, which can be calibrated by introducing the corresponding coefficients. The theory and simulation model may be used as a theoretical reference for the fusing current analysis of the bonding wire. |
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