| SnBiAg-xIn, a kind of low temperature lead-free solder, was prepared by electromagnetic induction heating furnace. X-ray diffractometer (XRD), scanning electron microscope (SEM), energy dispersive spectrometer (EDS), universal tensile testing machine and Vickers hardness tester were used to study the effect of In on the phase, microstructure and mechanical properties of the solder. The results show that the addition of In element into the solder matrix can refine the organizational structure of the solder. The tensile strength of the alloy solder increases with the increase of In content, however, the hardness and ductility increase first and then decrease. In addition, when the amount of In is 5% in the solder, the precipitated Bi phase is accordingly reduced, leading to an improvement in the ductility and comprehensive mechanical properties of the solderr. |
