文章摘要
低温烧结无颗粒型银导电墨水的制备及其性能研究
Preparation and properties of particle-free silver conductive ink suitable for low temperature sintering process
投稿时间:2023-02-27  
DOI:
中文关键词: 低温烧结  银无颗粒墨水  薄膜  柔性  高导电
英文关键词: low temperature sintering  silver particle free ink  thin film  flexible  high conductive
基金项目:稀贵金属综合利用国家重点实验室基金(SKL-SPM-202016, SKL-SPM-202019)
作者单位
王思萌 东北大学 材料科学与工程学院先进陶瓷材料研究中心材料各向异性与织构教育部重点实验室沈阳 110819 
谢望 东北大学 材料科学与工程学院先进陶瓷材料研究中心材料各向异性与织构教育部重点实验室沈阳 110819 
姚孟智 东北大学 材料科学与工程学院先进陶瓷材料研究中心材料各向异性与织构教育部重点实验室沈阳 110819 
李晓东 东北大学 材料科学与工程学院先进陶瓷材料研究中心材料各向异性与织构教育部重点实验室沈阳 110819 
张牧 东北大学 材料科学与工程学院先进陶瓷材料研究中心材料各向异性与织构教育部重点实验室沈阳 110819
东北大学 佛山研究生院广东 佛山 528311 
孙旭东 东北大学 材料科学与工程学院先进陶瓷材料研究中心材料各向异性与织构教育部重点实验室沈阳 110819
东北大学 佛山研究生院广东 佛山 528311 
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中文摘要:
      导电墨水是柔性印制电子发展的关键,然而,目前导电墨水的烧结温度仍较高,限制了其在某些柔性基材上的使用。本文以乙酸银作为前驱体、氨水为络合剂、乙醇为助剂、甲酸为还原剂,制备了一种可低温烧结的无颗粒型银导电墨水。将该导电墨水滴涂到PET基材后于烘箱中进行烧结成银膜,采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、傅里叶红外光谱仪(FTIR)等测试设备对制备的导电墨水和薄膜进行表征。系统研究了还原剂甲酸以及助剂乙醇对导电墨水及薄膜的性能影响。结果表明,该导电墨水具备良好的稳定性,经过90 ℃低温烧结60 min,其电阻率为11.83 μΩ.cm。通过调控墨水配方,银薄膜的粗糙度和均匀性得到显著改善,且薄膜具有良好的弯折性能。
英文摘要:
      Conductive ink is the key to the development of flexible printed electronics. However, at present, the sintering temperature of conductive ink is still high, which restricts its use in some flexible substrates. This paper reported a kind of non-granular silver conductive ink which can be sintered at low temperature. The particle-free silver conductive ink was prepared from silver acetate using ammonia as the complexing agent, ethanol as an auxiliary agent and formic acid as a reducing agent. The obtained conductive ink droplets were coated on PET substrate and then sintered into film in an oven. The conductive ink and film were characterized by means of X-ray diffractometer (XRD), scanning electron microscope (SEM), Fourier infrared spectrometer (FTIR) and other methods. The effects of formic acid and ethanol on the properties of the conductive ink and film were systematically investigated. The results show that the conductive ink has good stability. After sintered at 90 ℃ for 60 min, its resistivity is 11.83 μΩ.cm. By adjusting the ink formula, the roughness and uniformity of silver film can be improved significantly and the film will exhibit good bending performance.
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