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| 3D打印-激光烧结制备导体和介质厚膜的显微结构与性能 |
| Microstructures and properties of the conductor and dielectric thick films prepared by 3D printing - laser sintering |
| 投稿时间：2023-04-24 |
| DOI： |
| 中文关键词: 厚膜混合集成电路 3D打印 激光烧结 丝网印刷 显微结构 性能 |
| 英文关键词: thick-film hybrid integrated circuit 3D printing laser sintering screen printing microstructure performance |
| 基金项目:安徽省重点研究与开发计划(202104a05020017) |
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| 中文摘要: |
| 为拓展3D打印技术在厚膜混合集成电路制备领域的应用，提高厚膜浆料烧结效率，采用3D直写+激光烧结制备三种导体浆料厚膜和一种介质浆料厚膜，并与常规的丝网印刷+高温炉烧结厚膜进行显微结构与性能的对比研究。结果表明，常规丝网印刷+高温炉烧结的导体及介质厚膜具有良好的显微结构与性能。相比而言，3D直写+激光烧结制备的导体厚膜平整连续、厚度均匀，焊接性能良好，但结构不够致密，部分导体厚膜存在膜层附着力不足，方阻偏大的问题；介质厚膜激光烧结后的致密性较导体厚膜更低，绝缘性能不满足要求。3D直写制备导体或介质浆料厚膜具有可行性，但激光烧结工艺参数有待优化，以实现厚膜的烧结致密化，提高厚膜与基板的结合强度。 |
| 英文摘要: |
| In order to expand the application of 3D printing technology to the thick-film hybrid integrated circuits and to improve sintering efficiency of the thick films, four kinds of thick films including three conductor films and a dielectric film were prepared via 3D direct printing followed by laser sintering. Subsequently, microstructures and properties of the obtained films were compared with those of the thick films fabricated by commonly-used screen printing & high-temperature furnace sintering. The results show that the thick conductor and dielectric films produced by using the common method exhibit fine microstructures and good properties. In contrast, the thick conductor films prepared by the 3D direct printing & laser sintering are flat and continuous with a uniform thickness and good welding performance, but the density of the films is not large enough to ensure acceptable adhesion and square resistance. The relative density of the thick dielectric film is much lower than those of the thick conductor films. As a result, the insulation performance of the thick dielectric film does not meet the standard requirements. Overall, it is feasible to prepare the thick conductor/dielectric films via 3D direct writing, but the laser sintering parameters should be optimized to fulfill sintering densification of the thick films, and further to improve their bonding strengths with the ceramic substrates. |
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