| The Ag-Cu-Ti brazing filler metal enables the bonding of copper and Si3N4 ceramics. However, during the brazing process, Ti tends to react with Cu to form intermetallic compounds, leading to a reduction in the interfacial bond strength. In this paper, we used a chemical reduction method to coat a uniform and dense layer of Ag on the surfaces of Cu and TiH2 with ascorbic acid as the reducing agent and Na2EDTA as the dispersant, at 30 ℃ for 30 minutes. Due to the high activity of Ti, the surface tension of molten silver is reduced, decreasing the wetting angle between molten silver and Si3N4 and improving the spreading performance of the solder. Additionally, the significant suppression of the reaction between Ti and Cu in the solder paste by coating with Ag enhances the solder paste activity, thereby improving the interfacial bond strength of the copper clad laminate. The analysis results revealed the spreading area of silver-coated solder on ceramics increased by 8.4% and the peel strength of the prepared ceramic coated copper plate increased by 16.7%. |
