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| 镀钯铜丝中钯层对可靠性影响的研究进展 |
| Research progress on the effect of palladium layer on the reliability of palladium-coated copper wire |
| 投稿时间：2024-03-07 |
| DOI： |
| 中文关键词: 镀钯铜丝 钯元素 金属间化合物(IMC) 可靠性 |
| 英文关键词: palladium-coated copper wire palladium intermetallic compound (IMC) reliability |
| 基金项目:云南贵金属实验室重大科技专项(YPML-2023050208, YPML-2023050205)；云南省科技人才与平台计划(202105AC160006)；昆明市春城产业技术领军人才专项(昆发改人才202303)；云南省中央引导地方发展资金项目(202407AA110010)；云南贵金属实验室科技计划项目(YPML-20240502099) |
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| 中文摘要: |
| 在半导体封装中，键合丝是决定元器件性能的关键性材料。近年来，随着黄金价格的不断上涨，键合丝市场正在进行由传统金丝过渡到新型键合丝的转型。目前，镀钯铜丝是较为理想的金丝替代品之一，具有成本低、抗氧化能力强、可靠性高等特点，而镀钯铜丝中钯层对键合性能起到了决定性的作用。本文综述了镀钯铜丝中钯层在成球过程中的分布状态和转移规律、钯元素对键合界面金属间化合物和键合工艺影响的研究进展，并根据目前的发展状况，展望未来镀钯铜丝的一些研究发展趋势。 |
| 英文摘要: |
| In the field of semiconductor packaging, bonding wire is the key material that determines performance. In recent years, the bonding wire market is undergoing a transition from traditional gold wire to new bonding wire due to the increasing gold price. At present, palladium-coated copper wire is one of the ideal substitutes for gold wire, which has the characteristics of low cost, good oxidation resistance and high reliability. The palladium layer in the palladium-coated copper wire plays a decisive role in the bonding property. This paper has reviewed the distribution and transfer of palladium layer in palladium-coated copper wire during the bonding process, the effect of palladium on intermetallic compounds at the bonding interface and the bonding parameter. According to the current development situation, research and development trends of palladium-coated copper wire in the future are forecasted. |
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