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| 超细片状银粉的制备技术研究进展 |
| Research Progress on Preparation Technologies of Ultra Fine Flake Silver Powder |
| 投稿时间：2017-03-07 |
| DOI： |
| 中文关键词: 金属材料 片状银粉 超细 化学还原 球磨 生长机制 |
| 英文关键词: metal materials flake silver powder ultra fine chemical reduction ball milling growth mechanism |
| 基金项目: |
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| 摘要点击次数: 2839 |
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| 中文摘要: |
| 超细片状银粉比传统大尺寸银粉可更好地满足电子产品发展需求。对机械球磨法和化学还原法2种制备超细片状银粉方法进行了对比分析。球磨法产率高、成本低，但易引入杂质且技术指标难保持一致；化学法制备的银粉形貌粒径均一性高，但产率低。介绍了化学还原法的技术特点，对其生长机理进行了分析。提出对球磨工艺的深入研究，以及化学法中保持高品质银粉情况下提高反应体系浓度，是超细片状银粉制备技术的研究重点。 |
| 英文摘要: |
| Ultra fine flake silver powder serves the development needs of electronic products better than the traditional large size of silver powder. The contrastive analysis was carried out for the mechanical milling and chemical reduction methods used for preparing ultra fine flake silver powder. Ball milling method has high yield and low cost, but it is easy to introduce impurities and the technical specifications are difficult to maintain. The silver particles prepared by chemical method has high homogeneity and low yield. The technical characteristics of chemical reduction method are introduced, and its growth mechanism is discussed. The further research on ball milling technology and the concentration of reaction system under high quality silver powder in chemical process are the key points for the preparation technology of ultrafine flake silver powder. |
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