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| Cu-Au多层膜力学性能的纳米压痕测试 |
| Nanoindentation Test of Cu-Au Multilayer Film |
| Received:April 27, 2013 |
| DOI： |
| 中文关键词: 金属材料 多层膜 硬度 弹性模量 变形行为 |
| 英文关键词: metal materials multilayer film hardness elastic modulus deformation behavior |
| 基金项目: |
| Author Name | Affiliation | E-mail | | YAN Lingyun | Department of Mechanical and Electrical Engineering, Sichuan College of Architectural Technology,Deyang 618000, Sichuan, China | yny0922@sina.com | | JIA Yizheng | Department of Mechanical and Electrical Engineering, Sichuan College of Architectural Technology,Deyang 618000, Sichuan, China | | | BAO Zongxian | Department of Mechanical and Electrical Engineering, Sichuan College of Architectural Technology,Deyang 618000, Sichuan, China | | | TAO Yong | Department of Mechanical and Electrical Engineering, Sichuan College of Architectural Technology,Deyang 618000, Sichuan, China | | | WU Pengfei | Department of Mechanical and Electrical Engineering, Sichuan College of Architectural Technology,Deyang 618000, Sichuan, China | |
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| 中文摘要: |
| 采用纳米压痕仪研究了Cu-Au多层膜的硬度、弹性模量及其在压头下的变形行为。结果表明，随单层膜厚度(h)的减小，Cu-Au多层膜的弹性模量略有减小。Cu-Au多层膜的硬度随单层膜厚度的减小而增加，当h≥50 nm时，硬度随
线性增加；当h<50 nm时，硬度与
偏离了原来的线性关系，且硬度随
的增大而增大的趋势开始弱化。在单层膜厚度为25 nm的Cu-Au多层膜的压痕附近，出现了“挤出”和剪切带。 |
| 英文摘要: |
| The elastic modulus, hardness and deformation behavior around indent of the Cu-Au multilayer film were investigated by using a nanoindentor. It was found that with decreasing individual layer thickness (h) the elastic modulus exhibited a slight decrease whereas the hardness of the Cu-Au multilayer film increased. In the case of h≥50 nm, the hardnessincreases linearly with
. When h is less than 50 nm, the increase in hardnesswith
deviates from the linear relation and shows a weak depth dependence. In addition, the material pile-up and shear bands around the indent in Cu-Au multiplayer film with individual layer thickness of 25 nm were also observed. |
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