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| 低温固化银浆烘干后断裂失效分析 |
| The Fracture Failure Analysis after Drying on Low Temperature Curing Silver Slurry |
| Received:July 10, 2013 |
| DOI： |
| 中文关键词: 金属材料 低温固化 银浆 线路断裂 失效 |
| 英文关键词: metal materials low temperature curing silver paste line fault failure |
| 基金项目: |
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| 中文摘要: |
| 针对低温银浆固化后出现的断裂失效现象，通过增加烘烤时间、提高烘烤温度、高温高湿下处理、冷冻情况下折叠破坏以及采用溶剂腐蚀等方法进行实验研究。采用放大镜观察以及电阻变化测试，确认了失效原因在于某些溶剂再次溶解了浆料中的树脂，而后出现二次固化收缩，从而出现线路断裂失效现象。 |
| 英文摘要: |
| The low temperature silver paste fracture failure after curing were studied by increasing the baking time, improving the baking temperature, processing on the condition of high temperature and high humidity, folding damage under freezing as well as the solvent corrosion. Through an optical magnifier observation and resistance test, the reasons for fracture failure of silver paste were confirmed that a certain solvent redissolved paste resin, result in the twice curing shrinkage and arising line failure phenomenon. |
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