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贵金属键合丝材料的研究进展 |
Research Progress on thePrecious Metal Bonding Wire Materials |
Received:August 13, 2013 |
DOI: |
中文关键词: 金属材料 贵金属键合丝 合金成分 制备工艺 发展现状 |
英文关键词: metal materials precious metal bonding wire alloy composition preparation technology research state |
基金项目:省院所技术开发专项(2011CF012)、国家支撑计划(2012BAE06B05)。 |
Author Name | Affiliation | E-mail | CHEN Yongtai | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | cytqqq@126.com | XIE Ming | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | WANG Song | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | ZHANG Jiming | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | YANG Youcai | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | LIU Manmen | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | WANG Saibei | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | HU Jieqiong | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | LI Aikun | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | | WEI Kuan | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China | |
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中文摘要: |
贵金属键合丝是半导体封装的关键材料之一,详细综述了键合金丝、键合金银丝、键合银丝和镀钯键合铜丝的合金成分设计,制备工艺和发展现状,并展望了其未来发展前景。 |
英文摘要: |
Precious metal bonding wire are one of key materials in semiconductor packaging. The alloy composition, preparation technology and research situation of Au bonding wire, Au-Ag bonding wire, Ag bonding wire and Pd-plated bonding Cu wire were summarized. In the meantime, the research prospect of precious metal bonding wire was also forecasted. |
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