Abstract
贵金属键合丝材料的研究进展
Research Progress on thePrecious Metal Bonding Wire Materials
Received:August 13, 2013  
DOI:
中文关键词: 金属材料  贵金属键合丝  合金成分  制备工艺  发展现状
英文关键词: metal materials  precious metal bonding wire  alloy composition  preparation technology  research state
基金项目:省院所技术开发专项(2011CF012)、国家支撑计划(2012BAE06B05)。
Author NameAffiliationE-mail
CHEN Yongtai State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China cytqqq@126.com 
XIE Ming State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
WANG Song State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
ZHANG Jiming State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
YANG Youcai State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
LIU Manmen State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
WANG Saibei State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
HU Jieqiong State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
LI Aikun State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
WEI Kuan State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co. Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
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中文摘要:
      贵金属键合丝是半导体封装的关键材料之一,详细综述了键合金丝、键合金银丝、键合银丝和镀钯键合铜丝的合金成分设计,制备工艺和发展现状,并展望了其未来发展前景。
英文摘要:
      Precious metal bonding wire are one of key materials in semiconductor packaging. The alloy composition, preparation technology and research situation of Au bonding wire, Au-Ag bonding wire, Ag bonding wire and Pd-plated bonding Cu wire were summarized. In the meantime, the research prospect of precious metal bonding wire was also forecasted.
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