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| 金铂钯合金粉末的特性对低温共烧电子浆料性能的影响 |
| The Influence of AuPtPd Alloy Powder Properties on Electronic Paste for LTCC |
| Received:July 17, 2014 |
| DOI： |
| 中文关键词: 金属材料 金铂钯 合金粉 电子浆料 低温共烧陶瓷 |
| 英文关键词: metal materials Au-Pt-Pd alloy powder electric paste low temperature co-fired ceramic |
| 基金项目:国家自然科学基金项目(51261008)、国家科研院所技术开发研究专项(2014EG115007)、昆明市科技局高新技术研究与开发项目(2013-02-02-A-G-02-3040)。 |
| Author Name | Affiliation | E-mail | | JIN Wuhui | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | 740503608@qq.com | | CHEN Liqiao | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | chenlq118@126.com | | LI Shihong | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | LV Gang | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | LI Junpeng | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | LUO Hui | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | |
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| 中文摘要: |
| 以金铂钯粉末作为导电相的电子浆料由于其优异的可焊性、耐焊性与可靠性，成为低温共烧工艺配套用关键电子浆料之一。采用2种不同特性的金铂钯合金粉末调制出相应的浆料，比较研究了2种浆料与Ferro A6生瓷料带实施共烧后的匹配性、电学性能、可焊性与耐焊性、附着力等性能。结果表明，高密度、亚微米级球形粉制备的浆料具有更好的综合性能。 |
| 英文摘要: |
| Due to its excellent solderability, soldering resistance and high-reliability, the paste composed of trimetallic AuPtPd alloy powders is one of the key electronic pastes to apply for low temperature co-fired ceramic technology. Two different characteristics of AuPtPd alloy powders were used to prepare two electronic pastes, and matching ability of the pastes with Ferro A6 tape, and electrical properties and properties of solder resistance and adhesion strength of the pastes were studied. The experimental results show that the pastes made of submicron spherical powders with high density have better properties. |
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