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| 导电银胶用片状银粉的制备 |
| Preparation of Flake Silver Powders Used for Conductive Adhesive |
| Received:May 23, 2014 |
| DOI： |
| 中文关键词: 金属材料 导电银胶 片状银粉 片状率 粒径均匀 |
| 英文关键词: metal materials conductive adhesive flake silver powder flaky rate even particle size |
| 基金项目:山东省中青年科学家科研奖励基金项目(BS2011CL036)、中国科学院院地合作项目。 |
| Author Name | Affiliation | | JU Wei | Key Lab for Adhesion & Sealing Materials of Shandong Province, New Material Institute, Shandong Academy of Sciences, Ji’nan 250014, China | | MA Wangjing | Technical Institute of Physics and Chemistry, Chinese Academy of Science, Beijing 100190, China | | PENG Dan | Key Lab for Adhesion & Sealing Materials of Shandong Province, New Material Institute, Shandong Academy of Sciences, Ji’nan 250014, China | | MU Qiuhong | Key Lab for Adhesion & Sealing Materials of Shandong Province, New Material Institute, Shandong Academy of Sciences, Ji’nan 250014, China | | ZHANG Fangzhi | Key Lab for Adhesion & Sealing Materials of Shandong Province, New Material Institute, Shandong Academy of Sciences, Ji’nan 250014, China | | CHEN Yixiang | Technical Institute of Physics and Chemistry, Chinese Academy of Science, Beijing 100190, China |
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| 中文摘要: |
| 采用机械球磨法制备片状银粉，通过扫描电镜(SEM)、激光粒度分析仪和热重分析仪表征了银粉的形貌、粒度及纯度，研究球磨介质、球磨时间以及球磨前驱体球形银粉的形貌对片状银粉形貌及粒度的影响。结果表明，以乙醇为球磨介质，球磨时间为15 h，并采用粒径均一的球形银粉为球磨前驱体，能够机械球磨制备片状率高，粒径大小在4~6 μm且均匀的片状银粉。将片状银粉配制成银胶，印刷并固化成线路后，测试了其电导率，达到了应用指标。 |
| 英文摘要: |
| The flake silver powders were prepared by mechanical ball milling, and then characterized by the scanning electron microscopy (SEM), thermo-gravimetric analyzer and laser particle size analyzer. Effects of preparative conditions on the physical performance of resulting flake silver powders were also investigated. The flake silver powders with a high flaky rate and an even particle size of 4~6 μm could be prepared, when ethanol was used as the milling medium, milling time was 15 h and the spherical silver powders with an even particle size were chosen as a precursor. Finally, the flake silver powders were fabricated into conductive adhesive according to the formulation and solidified to an electronic circuit. Its electrical conductivity conformed to the application standard. |
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