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| 一种耐高温银导电胶的研究 |
| Research on Silver A Conductive Adhesive with High-Temperature-Resistant |
| Received:April 02, 2015 |
| DOI： |
| 中文关键词: 金属材料 导电胶 银 耐高温 酚醛树脂 |
| 英文关键词: metal materials conductive adhesive silver high temperature resistant phenolic resin |
| 基金项目:国家科研院所技术开发研究专项(2014EG115007)，云南省工信委、财政厅2014年可再生能源发展专项(2014020208)。 |
| Author Name | Affiliation | E-mail | | LIANG Yun | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China | 527986693@qq.com | | LI Junpeng | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China | lijunpeng@ipm.com.cn | | LI Shihong | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China | | | JIN Wuhui | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China | | | LÜ Gang | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China | | | LUO Hui | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China | |
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| 中文摘要: |
| 选用片状银粉作为导电填料，合成了酚醛类树脂为基体树脂，并以六亚甲基四胺为固化剂，制备了一种耐高温导电胶。讨论了体积电阻率与固化时间、固化温度、固化剂用量以及银粉填充量的关系，并确定了最佳工艺及配方。通过扫描电镜确定了最优分散剂，通过热重差热(TG/DSC)分析得到了导电胶的最初分解温度为366℃，耐热性能优异。 |
| 英文摘要: |
| To prepare a high-temperature-resistant conductive adhesive, flake silver powder was selected as the conductive filler, phenolic resin as the matrix resin, and hexamethylenetetramine as the curing agent. The relationships among the volume resistivity and the curing time, the curing temperature, the amount of curing agent, and the amount of silver powder were discussed, and the optimum formula was defined. The best dispersant was chosen by the method of SEM, and the initial decomposition temperature of 366℃ was obtained from TG/DSC. The heat resistant of the conductive adhesive thus prepared was excellent. |
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