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| Ag/Cu钎焊复合带材轧制和退火研究 |
| Research on Rolling and Annealing of Brazing Composite Ag/Cu Strip |
| Received:March 04, 2016 |
| DOI： |
| 中文关键词: 金属材料 Ag/Cu复合 钎焊 轧制 退火 原子扩散 |
| 英文关键词: metal materials Ag/Cu composite brazing rolling annealing atomic diffusion |
| 基金项目: |
| Author Name | Affiliation | E-mail | | HAN Jiqing | Xi’an Noble Rare Metal Materials Co. Ltd., Xi’an 710201, China | 52385247@qq.com | | ZHOU Longhai | Xi’an Noble Rare Metal Materials Co. Ltd., Xi’an 710201, China | zhoulonghai666@126.com | | ZHAO Tao | Xi’an Noble Rare Metal Materials Co. Ltd., Xi’an 710201, China | | | YU Jianjun | Xi’an Noble Rare Metal Materials Co. Ltd., Xi’an 710201, China | | | MA Xiaolong | Xi’an Noble Rare Metal Materials Co. Ltd., Xi’an 710201, China | |
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| 中文摘要: |
| 利用Ag-28Cu合金钎焊复合制备Ag/Cu复合材料，经轧制加工成复合带材。研究轧制变形和扩散退火对复合界面形貌、界面组织和性能的影响，以及界面元素扩散特征。结果表明，随着轧制变形量增加，Cu、Ag-28Cu和Ag发生协调变形，复合界面由波浪形，转变成锯齿状，最后Cu层整体向Ag层倾斜。随着加工率增加，Cu层硬度逐渐降低，Ag-28Cu层硬度显著升高，Ag层硬度不变。随着退火温度增加，界面组织逐渐长大粗化，复合层宽度增加。界面原子扩散行为主要是Cu原子向Ag中发生扩散，退火温度增加时，Ag-28Cu层中Cu原子向Ag侧逐渐减少，Ag层中的Cu原子含量增加，Cu和Ag层硬度没有发生变化，而Ag-28Cu层硬度逐渐降低。 |
| 英文摘要: |
| The Ag/Cu composite fillet prepared using Ag-28Cu brazing, was rolled into composite strip. The effects of rolling and diffusion annealing on composite interface morphology, microstructure and properties of interface were studied. And the diffusion characteristics of elements on interface were investigated. The results show that with the increase of rolling reduction, the deforms of Cu, Ag-28Cu and Ag were resulted coordinately. The interface of composite turns into zigzag form wavy, Cu layer inclines to the Ag layer finally. With the increase of processing rate, the hardness of Cu layer decreases gradually, the hardness of Ag-28Cu layer elevates significantly, the hardness of Ag layer unchanged. As the annealing temperature increasing, the interface structure grow gradually and the width of composite layer increases. The behavior of interface atomic diffusion is that Cu atoms mainly diffuse to the Ag. With annealing temperature increasing, Cu atoms in Ag-28Cu layer to Ag side reduces gradually, but Cu atoms in Ag layer increases. As annealing temperature increasing, the hardnesses of Cu and Ag layer have not changed, while the hardness of Ag-28Cu layer is decreased gradually. |
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