|
| 微电子封装用键合金丝替代产品的研究现状 |
| Research Status of Substitute Products for Gold Bonding Wires Used in Microelectronics Packaging |
| Received:November 03, 2016 |
| DOI： |
| 中文关键词: 金属材料 微电子封装 键合金丝 替代品 成分配比 技术难点 |
| 英文关键词: metal materials microelectronics packaging bonding gold wire substitute products composition key technology |
| 基金项目:云南省科技计划项目(2015DC016)、国家重点实验室开放基金(SKL-SPM-201515)。 |
| Author Name | Affiliation | E-mail | | KANG Feifei | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | kang85fei95@163.com | | WU Yongjin | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | wyj@ipm.com.cn | | KONG Jianwen | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | | | ZHOU Wenyan | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | | | YANG Guoxiang | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | | | PEI Hongying | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | | | ZHANG Kunhua | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | | | YU Jianshu | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co. Ltd., Kunming 650106, China | |
|
| Hits: 2888 |
| Download times: 3401 |
| 中文摘要: |
| 随着电子封装技术的发展，传统键合金丝在性能和价格上已经不具备优势。采用复合和改性等方法可以开发出满足要求的键合金丝替代品。总结了金包银复合键合丝、钯包铜复合键合丝、金合金键合丝和银合金键合丝共4种键合金丝替代产品的性能特点、成分配比、生产技术难点和关键点，介绍了部分典型产品，并对替代产品的发展趋势进行了展望。 |
| 英文摘要: |
| With the development of electronic packaging technology, the traditional bonding gold wire is losing the advantage, due to its low performance and high price. The substitute products have been developed by compounding and modifying the existing bonding gold wire, in order to meet new requirements. The present article summarized the performance feature, composition, key preparative technology of four substitute products. They are Au-coated Ag composite bonding wires, Pd-coated Cu composite bonding wire, Au alloy bonding wire and Ag alloy bonding wire. Some typical products were presented, and the future development was prospected. |
|
View Full Text
View/Add Comment Download reader |
| Close |
|
|
|