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| 低温共烧用可焊浆料用银钯合金粉特性研究 |
| Research on Characteristics of Ag-Pd Alloy Powder for LTCC Solderable Paste |
| Received:March 07, 2018 |
| DOI： |
| 中文关键词: 金属材料 电子浆料 低温共烧陶瓷 性能 银钯合金粉 |
| 英文关键词: metal materials electrical paste LTCC property Ag-Pd alloy powder |
| 基金项目:云南省青年基金(2017FD214)；云南省科技强省计划(2016020201)。 |
| Author Name | Affiliation | E-mail | | YAN Tingdong | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | 26331994@qq.com | | CHEN Guohua | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | SUN Liwei | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | LIANG Shiyu | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | FAN Mingna | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | LIU Nian | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | MA Xiaoya | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | | | LÜ Gang | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China | 13648890027@163.com |
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| 中文摘要: |
| 银钯合金粉末制备的电子浆料以其优异的导电、抗银离子迁移、可焊耐焊性，成为低温共烧陶瓷工艺(LTCC)配套用关键电子浆料之一。比较研究两种不同特性的银钯合金粉制备的浆料与Ferro A6生瓷带共烧后的匹配性、电学性能、附着力、可焊性与耐焊性等性能。高振实、大粒径的银钯合金粉制备的浆料与Ferro A6生瓷带共烧平整，电极膜层平整光滑，各项性能表现出优异。粒径较小的银钯合金粉，与瓷料烧结收缩率不匹配，基板翘曲严重，膜层起皱，导电性及可焊耐焊性相对较差。 |
| 英文摘要: |
| Due to its excellent conductivity, resistance of silver migration, solderability, and soldering resistance, the paste composed of Ag-Pd alloy powder is one of the key electronic pastes for low temperature co-fired ceramic technology (LTCC). The sintering matching, electrical properties, adhesion strength, solderability and solder resistance of the pastes prepared by two Ag-Pd alloy powders co-fired with Ferro A6 green tape had been studied. For the paste prepared by the Ag-Pd powder with high tapping density and large particle size, the co-fired electrode film is smooth, and its performance is excellent. However, the Ag-Pd paste with smaller particle size does not match the sintering shrinkage of Ferro A6. The substrate warpage is severe, and the electrode film is wrinkled. Its electrical conductivity and solderability are relatively poor. |
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