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| 铟银软钎料的制备与钎焊性研究 |
| Study on Preparation and Characterization of In-Ag Solders |
| Received:July 01, 2018 |
| DOI： |
| 中文关键词: 金属材料 铟银钎料 熔点 润湿性 接头强度 界面反应 |
| 英文关键词: metal materilas InAg solder the melting point wettability joint shear strength interfacial reactions |
| 基金项目: |
| Author Name | Affiliation | E-mail | | WU Xianji | Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110000, China | xjwu@imr.ac.cn | | WANG Kecheng | Lanzhou Institute of Physics, Lanzhou,730000, China | | | YANG Zhirong | Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110000, China | | | WANG Benxian | Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110000, China | |
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| 中文摘要: |
| 用感应熔炼方法制备了一系列InAg钎料，考察银添加量对铟基钎料性能的影响。采用化学分析和X射线衍射(XRD)对钎料的成分和物相进行了对比分析；采用示差扫描量热仪(DSC)测试了不同成分钎料的熔点；利用扫描电镜(SEM)对In-7Ag焊料与基体的界面反应进行了研究，并测试了不同成分钎料的润湿性及接头剪切强度。结果表明，In-7Ag具有较大的剪切强度以及良好的润湿性，是月球样品返回装置密封材料的不错选择。焊料与密封材料剧烈反应可能弱化焊接组织的一致性，不利于金属密封，因此，寻求合适的焊接温度和时间是未来研究的重点。 |
| 英文摘要: |
| A series of InAg solders were prepared by the high frequency induction melting method. Their components and phase analysis were conducted via chemical analysis and X-ray diffraction(XRD). Their melting point and surface morphology of brazing joint were characterized via differential scanning calorimeter(DSC) and scanning electron microscope(SEM), respectively. The effect of Ag addition on thermal property, joint shear strength and wettability of indium based solder alloys were investigated. The interfacial reactions of In-7Ag solder and the substrate were observed and discussed. Results showed that the addition of Ag improved both the melting point and joint shear strength of the solder alloys. In-7Ag has demonstrated large shear strength and appropriate wettability, which has a great potential to be the solder for the retrieving lunar sample container. Excessive interaction between solder and substrate for the improper temperature and time of brazing process, which will weaken homogeneity of the metallic seal. Therefore, the appropriate temperature and time of InAg solder must be founded in the future research. |
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