Abstract
混合银粉对导电银浆烧结膜层附着力的影响
Effect of Mixing Silver Powders on Adhesion of Conductive Silver Paste Sintered Coating
Received:September 25, 2018  
DOI:
中文关键词: 复合材料  银粉  导电银浆  电极膜层  附着力  烧结温度  压敏电阻器
英文关键词: composite material  silver powders  conductive silver paste  electrode coating  adhesive force  sintering temperature  varistor
基金项目:
Author NameAffiliationE-mail
TIAN Xiangliang State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China txl1980111@163.com 
FAN Mingna State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China  
LI Dongli Chemical Engineering Institute, Kunming Metallurgy College, Kunming 650031, China  
LI Wenlin State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China  
LIU Jisong State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China  
HUANG Fuchun State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China  
LIANG Shiyu State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China liangshiyu@ipm.com.cn 
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中文摘要:
      采用4种不同规格的银粉,并优选其中2种银粉按不同比例混合,制备得到不同氧化锌压敏电阻器用导电银浆;对烧结后的银浆样品进行表面形貌分析和附着力测试,并比较烧结温度对附着力的影响。结果表明,将2种单一银粉混合制备所得浆料烧结所得电极膜层表面更致密平整,附着力增加;调整合适的混合质量比,可以得到具有最大附着力的导电银浆;其机制可能是浆料在烧结过程中不同粒径的银粉相互填充间隙,产生协同作用,提高了膜层致密度。所得银浆最佳烧结温度为550~650℃。
英文摘要:
      Various conductive silver pastes for zinc oxide varistors were prepared by mixing two optimum silver powders in different proportions from four kinds of silver powders with different specifications. The surface morphology of sintered silver paste samples was analyzed and their adhesive force were tested, and the effects of sintering temperature on adhesive force were compared. The results show that the surface of the electrode coating sintered by mixing two kinds of silver powders is more compact and smooth, and that the adhesion increases. The conductive silver paste with the greatest adhesion can be obtained by adjusting the appropriate mixing mass ratio. The mechanism may be that silver powders with different sizes fill the gaps in the paste sintering process, which produces synergistic effect and improves the film density. The optimum sintering temperature of silver paste is between 550℃ and 650℃.
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