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| 触变剂加入方式对银合金焊膏流变学性能的影响 |
| Effect of the Adding Method of Thixotropic Agent on the Rheological Properties of Silver Alloy Solder Paste |
| Received:August 19, 2018 |
| DOI： |
| 中文关键词: 金属材料 触变剂 加入方式 银合金焊膏 流变学 |
| 英文关键词: metal materials thixotropic agent addition way silver alloy solder paste rheological properties |
| 基金项目: |
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| 中文摘要: |
| 采用不同的加入方式，使触变剂以分散态、溶胀凝胶态或溶解态存在于有机载体中，研究了由其制备所得不同银合金焊膏的流变学性能。结果表明，触变剂以分散态和溶胀凝胶态存在的焊膏，其触变性和结构恢复特性较好，且该状态下的触变剂与焊膏中的其他组分形成较强的内部网络结构，对提高焊膏的点胶性能和存储性能有利。 |
| 英文摘要: |
| Thixotropic agent was added to the organic carrier in different methods, so that it could be founded in the silver alloy solder paste in the state of dispersion, swelling gel or dissolution. The rheological properties of the silver alloy solder paste produced by adding thixotropic agent in different methods were measured. The results showed that the solder paste with thixotropic agent in dispersion state and swelling gel state exhibited good thixotropic and structural recovery properties. And thixotropic agent in dispersion state and swelling gel state had a strong internal network structure with other components in solder paste, which endowed it with improved dispensing property and storage performance. |
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