Abstract
纯铂在塑性加工过程的微观结构演变及力学性能研究
Study on Microstructure Evolution and Mechanical Properties of Pure Platinum during Plastic Processing
Received:February 15, 2019  
DOI:
中文关键词: 纯铂  溅射靶材  冷轧  退火  择优取向  晶粒尺寸
英文关键词: pure platinum  sputtering target  cold-rolling  annealing  preferred orientation  grain size
基金项目:国家重点研发计划项目(2017YFB0305503)、云南省国际合作计划项目(2014IA037)、云南省科技厅青年基金(2018FD143)
Author NameAffiliationE-mail
XU Yanting Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China xyt@ipm.com.cn 
WANG Yiqing Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China  
CHEN Jialin Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China  
GUO Junmei Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China  
WEN Ming Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China wen@ipm.com.cn 
WANG Chuanjun Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China  
TAN Zhilong Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China  
GUAN Weiming Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino Platinum Metals Co. Ltd., Kunming 650106, China  
Hits: 2528
Download times: 1993
中文摘要:
      靶材微观组织均匀性直接影响半导体集成电路溅射薄膜质量。采用金相显微镜、X射线衍射(XRD)和显微硬度计,研究了纯铂单向冷轧及热处理过程中的微观结构演变及力学性能。结果表明,纯铂单向冷轧时随变形量的增加晶粒沿轧向拉长,显微硬度逐渐上升;单向冷轧变形量为80%的纯铂在450℃退火发生再结晶,产生的细小等轴晶平均晶粒尺寸约为41 μm;随着退火温度升高,晶粒尺寸增大,显微硬度降低,纯铂由冷轧态(111)、(220)晶面择优取向过渡为(200)、(311)、(220)晶面择优取向。
英文摘要:
      The microstructure uniformity of target directly affects the quality of the sputter films of semiconductor integrated circuits. The evolution of microstructure and mechanical properties of pure Pt during unidirectional cold rolling and heat treatment were studied by optical microscope, X-ray diffraction (XRD) and microhardness tester. The results showed that the microhardness of pure Pt gradually increased with deformation, and that the grains were also elongated along the rolling direction. Pure Pt with a unidirectional cold rolling deformation of 80% was recrystallized after annealed at 450℃, resulting in a fine equiaxed crystal with an average grain size of about 41 μm. As the annealing temperature increasing, the grain size increased and the microhardness decreased. The preferred orientation of the lattice planes transformed from (111) and (220) in cold-rolling state to (200), (311) and (220).
View Full Text   View/Add Comment  Download reader
Close