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| 银铜合金再结晶过程组织性能演变研究 |
| Study on the Evolution of Microstructure and Properties during Recrystallization of Ag-Cu alloy |
| Received:August 29, 2019 |
| DOI： |
| 中文关键词: 银铜合金 晶粒尺寸 显微硬度 电阻率 |
| 英文关键词: AgCu alloy grain size micro-hardness resistivity |
| 基金项目:河南省省科技计划项目(No. 182102210138) |
| Author Name | Affiliation | E-mail | | HOU Jiangtao* | Zhengzhou Research Institute of Mechanical Engineering Co.LTD., Zhengzhou 450001, China | houjiangtao@foxmail.com | | HAO Qingle | Zhengzhou Research Institute of Mechanical Engineering Co.LTD., Zhengzhou 450001, China | | | ZHANG Lei | Zhengzhou Research Institute of Mechanical Engineering Co.LTD., Zhengzhou 450001, China | | | ZHONG Sujuan | Zhengzhou Research Institute of Mechanical Engineering Co.LTD., Zhengzhou 450001, China | | | ZHU Kun | Zhengzhou Research Institute of Mechanical Engineering Co.LTD., Zhengzhou 450001, China | | | XIE Ming | Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for ComprehensiveUtilization of Platinum Metals, Sino-Platinum Metals Co.Ltd., Kunming 650106, China | | | QU Wenqing | School of Mechanical Engineering & Automation, Beihang University, Beijing 100191, China | |
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| 中文摘要: |
| 银铜合金广泛应用于电工行业，通过硬度检测、电阻率检测、扫描电镜观察，研究了Ag-10Cu在退火过程析出行为对合金组织性能的影响。结果表明，300~500℃退火阶段，合金中铜基体颗粒开始析出，材料硬度及电阻率随退火温度增加而减小；500~700℃退火阶段，合金再结晶过程基本结束，析出铜颗粒长大，并向晶界生长，材料电阻率随退火温度的增加而增加，硬度逐渐趋于平缓。 |
| 英文摘要: |
| AgCu alloy is widely used in electrical industry. The effect of precipitation behavior of Ag-10Cu during annealing on the structure and properties of Ag-10Cu alloy was studied by hardness testing, resistivity testing and scanning electron microscopy. The results show that during annealing at 300~500℃, the grain size of the alloy increases gradually, the defects decrease, the alloy copper particles precipitate, and the hardness and resistivity decrease with the increase of annealing temperature. During annealing at 500~700℃, the recrystallization process of the alloy basically ends, the precipitated copper particles grow up and grow to the grain boundary, and the resistivity of the alloy decreases with annealing temperature. With the increase of temperature, the hardness gradually tends to be flat. |
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