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| 银基焊膏的研究进展 |
| Research Progress on Silver-based Solder Paste |
| Received:September 10, 2020 |
| DOI： |
| 中文关键词: 银基焊膏 银基合金 助焊剂 |
| 英文关键词: silver-based solder paste silver-based alloy flux |
| 基金项目:国家重点研发计划(2017YFB0305700)；国家自然科学基金(NSFC-云南联合基金)(U1602271，U1602275)；云南省稀贵金属材料基因工程(202002AB080001-1) |
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| 中文摘要: |
| 银具有高导电导热、耐腐蚀、抗氧化、延展性好等特性，制粉后添加不同合金元素与助焊剂以合适的比例混合制得的焊膏，在金属焊接与电子表面装联领域有着广泛的应用。结合近年来银基焊膏的最新研究进展，综述了银基焊膏中焊粉与助焊剂的研究现状，展望了银基焊膏的发展趋势。 |
| 英文摘要: |
| Silver has the characteristics of high conductivity, high temperature resistance, corrosion resistance, and good ductility. When powder is made, different alloying elements and fluxes are mixed in a suitable ratio to prepare solder pastes that are widely used in the field of metal welding and electronic surface mount application. Combining with the latest research progress of silver-based solder paste in recent years, this article reviews the two major components of silver-based solder paste: the research status of solder powder and flux, and prospects the future development trend of silver-based solder paste |
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