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| 一种电子元器件银浆用玻璃粉的研制 |
| Development of Silver Glass Powder for Electronic Components Silver Paste |
| Received:July 05, 2020 |
| DOI： |
| 中文关键词: 金属材料 银浆 性能 玻璃粉 附着力 |
| 英文关键词: metal materials silver paste performance glass powder adhesion |
| 基金项目: |
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| 中文摘要: |
| 不同基体的银浆需要采用不同成分的玻璃粉才能达到合适的性能。采用Bi2O3-SiO2-B2O3体系，研究了Ag2O对Zn2SiO4介质陶瓷附着力的影响。当Bi2O3含量(质量分数)为65%，SiO2含量为15%，B2O3含量为10%，Ag2O含量为5%，Al2O3含量为5%时，制备的银浆附着力≥20N；所得银浆料的印刷性能、方阻、附着力、与焊料的润湿性及耐焊性等各项指标符合要求。 |
| 英文摘要: |
| Silver paste with different substrates, the glass powder with different composition is needed. The material system Bi2O3-SiO2-B2O3 is used to study the effect Ag2O on the adhesion of Zn2SiO4 dielectric ceramics. When the content (mass fraction) of Bi2O3 is 65%, SiO2 is 15%, B2O3 is 10%, Ag2O is 5%, and Al2O3 is 5%, the prepared silver paste adhesion is larger than≥20N. All the indexes of the silver paste, such as printing performance, square resistance, adhesion, wettability and solder resistance, can meet the requirements index. |
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