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| 聚合物银导体浆料的研制 |
| Development of Polymer Silver Conductor Paste |
| Received:August 04, 2020 |
| DOI： |
| 中文关键词: 金属材料 银浆 性能 环氧树脂 固化 片状银粉 |
| 英文关键词: metal materials silver paste performance epoxy resin curing flake silver |
| 基金项目: |
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| 中文摘要: |
| 研制了一种低温固化的聚合物银导体浆料。研究了片状银粉直径、分散剂用量及固化剂用量对导体浆料性能的影响。结果表明，当片状银粉直径为8~10 μm，分散剂用量(质量分数)为2%，固化剂用量在10%时，所得银浆料的印刷性能、方阻、附着力、室温存储性能等各项指标符合要求。 |
| 英文摘要: |
| A polymer silver conductor slurry cured at low temperature was developed. The effects of the diameter of flake silver powder, the amount of dispersant and the amount of hardener on the properties of conductor paste were studied. And it turns out ,. When the diameter of flake silver powder is 8-10 m, the dosage (mass fraction) of dispersant is 2%, and the dosage of hardener is 10%, The printing performance, square resistance, adhesion and room temperature storage performance of the silver paste met the requirements. |
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