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| 磁控溅射银膜的晶粒结构对载流摩擦行为的影响 |
| The effect of crystallographic structure of magnetron sputtering silver film on current-carrying friction behavior |
| Received:October 09, 2020 |
| DOI： |
| 中文关键词: 磁控溅射 银膜 孪晶银 载流摩擦 |
| 英文关键词: magnetron sputtering Ag film twinned silver current-carrying |
| 基金项目:中央高校基本科研业务费专项(2019QN040)；内蒙古自治区高等学校科学研究项目(NJZY19130)；内蒙古自治区自然科学基金(2018MS05038)；中央高校基本科研业务费面上项目(2019MS016) |
| Author Name | Affiliation | E-mail | | CAO Ya-nan | School of Energy Power and Mechanical Engineering, North China Electric Power University, Beijing 102206, China
School of Mechanical Engineering, Analysis and Testing Center | yanan-20050519@163.com | | XIA Yan-qiu | School of Energy Power and Mechanical Engineering, North China Electric Power University, Beijing 102206, China | xiayq@ncepu.edu.cn | | DUAN Bao-yu | Inner Mongolia University ofScience and Technology, Baotou 014010, Inner Mongolia，China | | | MU Wen-xiong | School of Energy Power and Mechanical Engineering, North China Electric Power University, Beijing 102206, China | | | WU Hao | School of Energy Power and Mechanical Engineering, North China Electric Power University, Beijing 102206, China | |
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| 中文摘要: |
| 用磁控溅射法制备银膜，在导电脂润滑条件下进行载流摩擦实验，采用SEM、XRD、EBSD研究银膜在载流摩擦实验前后的晶粒结构变化。结果表明，磁控溅射方法制备的银膜表面晶粒均匀致密，断面形貌显示膜基结合好。银膜在(111)晶面出现择优取向，银膜表层和中层的晶粒分布和生长方向有利于其力学性能的发挥，且保证了较稳定的导电能力。银膜晶粒尺寸较小，平均晶粒尺寸为0.673 μm，起到细晶强化的作用，且晶粒图中有不连续分布的孪晶银出现。磨损形貌较为光滑，存在点蚀坑能够容纳导电润滑脂，提升材料的导电性能。 |
| 英文摘要: |
| The silver film with a copper substrate was prepared by a magnetron sputtering method, and the current-carrying friction experiments were carried out under conductive grease lubrication conditions. Scanning electron microscope (SEM), X-ray diffraction (XRD), electron backscatter diffraction (EBSD) were used to study the changes of grains and crystal structure of the silver film before and after current-carrying friction experiments. The experimental results showed that the silver film surface was uniform and compact, and that the film base was well bonded on the cross sections. The silver film had a preferred orientation on the (111) crystal plane. The grain distribution and growth direction of the surface and middle layers of the silver film were conducive to its tribological properties and ensured a relatively stable electrical conductivity. The average grain size of the silver film was 0.673 μm, and it played a role of fine grains strengthening, and there were discontinuously distributed twin silver appears in the grain diagram. The wear morphology was relatively smooth, and there were pitting pits that can hold conductive grease and improve the conductivity of the material. |
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