Abstract
贵金属超细丝材截面的EBSD与三维重构表征
EBSD and 3D reconstruction characterization of precious metal ultrafine wire sections
Received:March 23, 2020  
DOI:
中文关键词: 金属材料  超细丝材  扫描电子显微镜  聚焦离子束  电子背散射衍射  三维重构
英文关键词: metal materials  ultrafine wire  SEM  FIB  EBSD  3D tomography
基金项目:云南省刘志权专家工作站(202005AF150045);云南省基础研究计划青年基金(202001AU070082);国家重点研发计划(2017YFB0305405)
Author NameAffiliationE-mail
YUAN Xiao-hong Sino-Platinum Metals Co.Ltd., Kunming Institute of Precious Metals, Kunming 650106, China yxh@ipm.com.cn 
WANG Yi-qing Guiyan Testing Technology Yunnan Co.Ltd., Kunming 650106, China  
ZHOU Wen-yan Sino-Platinum Metals Co.Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
GAN Jian-zhuang Sino-Platinum Metals Co.Ltd., Kunming Institute of Precious Metals, Kunming 650106, China
Guiyan Testing Technology Yunnan Co.Ltd., Kunming 650106, China 
gjz@ipm.com.cn 
CHEN Guo-hua Guiyan Testing Technology Yunnan Co.Ltd., Kunming 650106, China  
KANG Fei-fei Sino-Platinum Metals Co.Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
MAO Duan Sino-Platinum Metals Co.Ltd., Kunming Institute of Precious Metals, Kunming 650106, China  
BI Qin-song Guiyan Testing Technology Yunnan Co.Ltd., Kunming 650106, China  
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中文摘要:
      贵金属超细丝材常用于精密电子功能器件的关键位置,但由于其加工成品尺寸微细传统技术无法准确表征超细丝材的微观精细结构。采用聚焦离子束-电子背散射衍射(FIB-EBSD)联用的超细丝材截面制样与表征方法,精确表征出了4种不同材质贵金属超细丝材的晶粒、取向、织构以及晶界等微观结构信息;而3D EBSD三维重构技术将微观结构分析实现为3D动态过程,更加直观地反应出超细丝材的真实微观结构信息。
英文摘要:
      Precious metal ultra-fine wires are critical components in precision electronic functional devices. However, due to their ultrafine sizes, traditional techniques cannot accurately characterize the micro-structures of ultrafine wires. By using a combination technique of a focused ion beam and an electron backscatter diffraction method, (FIB-EBSD) four precious metal ultrafine wires sections were prepared, and their microstructures of grain orientation, texture and grain boundary were accurately characterized. In addition, the 3D reconstruction technology (3D EBSD) realized the analysis of microstructures as a 3D dynamic process, which more intuitively reflects the true microstructure information of ultrafine wires.
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