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| Ni对Ag-22Cu-17Zn-5Sn钎料铸态组织与力学性能的影响 |
| Effect of Ni on the microstructure and mechanical properties of Ag-22Cu-17Zn-5Sn filler alloy |
| Received:January 20, 2022 |
| DOI： |
| 中文关键词: 金属材料 Ag-Cu-Zn-Sn钎料 Ni含量 显微组织 力学性能 |
| 英文关键词: metal materials Ag-Cu-Zn-Sn filler metal Ni content microstructure mechanical properties |
| 基金项目:云南省科技厅科研院所技术开发研究专项(2019DC003)；云南省重大科技计划(202102AB080008) |
| Author Name | Affiliation | E-mail | | WANG Xing-yu | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | 1342907626@qq.com | | TAN Zhi-long | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | WANG Min-xin | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | WU Xiao-fei | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | YANG Chun-rong | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | QIAN Chao | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | XIE Dong | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | ZHAO Jun | Sino-Platinum Metals Co. Ltd., Kunming 650106, China | |
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| 中文摘要: |
| 采用光学显微镜、扫描电镜、能谱仪、X射线衍射仪、热分析仪以及拉力试验机研究不同Ni含量对Ag-22Cu-17Zn-5Sn钎料显微组织、熔化特性以及力学性能的影响。结果表明，Ag-22Cu-17Zn-5Sn-xNi钎料主要由Ag基体、Cu基固溶体、Cu0.64Zn0.36以及Cu40.5Sn11化合物组成。当Ni含量增加至0.6%时，钎料组织由粗大枝晶转变为均匀细小晶粒，平均晶粒尺寸约为4.53 μm。随着Ni含量的增加钎料的固相线温度基本不变，而液相线温度和熔化温度区间出现不同程度的上升；抗拉强度先减小后增大再减小，延伸率先增大后减小的趋势，而钎料硬度(HV0.2)从140逐渐下降到100。当Ni含量为0.6%时，钎料的抗拉强度最高达到372 MPa，延伸率提高到7.6%。 |
| 英文摘要: |
| The effects of various Ni contents on the microstructure, melting characteristics and mechanical properties of Ag-22Cu-17Zn-5Sn filler alloy were investigated by optical microscope, scanning electron microscope, energy dispersive spectroscopy, X-ray diffraction, thermal analyzer and tensile testing machine. The results indicate that the Ag-22Cu-17Zn-5Sn-xNi filler alloy is mainly comprised of Ag, Cu based solid solution, Cu0.64Zn0.36 and Cu40.5Sn11 compounds. When the Ni content is increased to 0.6%, the solder microstructure changes from coarse dendritic to uniform fine grains, and its average grain size is about 4.53 μm. As the Ni content increases, the solidus temperature of the solder remains basically unchanged, while the liquidus temperature and the melting temperature range rise in varying degrees. The tensile strength decreases first, then increase and then decreases, and the elongation increases first and then decreases, the hardness of solder (HV0.2) gradually decreases from 140 to 100. When the Ni content is 0.6%, the maximum tensile strength of the solder reaches up to 372 MPa and the elongation increases to 7.6%. |
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