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| AgCuInSn钎料的研究进展综述 |
| Review on research progress of AgCuInSn solder |
| Received:August 30, 2021 |
| DOI： |
| 中文关键词: AgCuInSn钎料 银基钎料 制备方法 研究进展 |
| 英文关键词: AgCuInSn solder silver-based solder preparation method research progress |
| 基金项目:国家科技部“科技助力经济2020”重点专项；云南省稀贵金属材料基因工程(202002AB080001-1)；云南省2019材料基因工程项目(2019ZE001-2)；云南省科技人才与平台计划(202105AE160027) |
| Author Name | Affiliation | E-mail | | BI Ya-nan* | Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co.Ltd., Kunming 650106, China | byn0902@163.com | | ZHANG Nai-qian | China Aviation Development Shenyang Liming Aero Engine Co., Ltd., Shenyang 110043, Liaoning, China | | | WEI Ming-xia | China Aviation Development Shenyang Liming Aero Engine Co., Ltd., Shenyang 110043, Liaoning, China | | | ZHAO Jun | Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co.Ltd., Kunming 650106, China | | | WANG Jian-ping | Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co.Ltd., Kunming 650106, China | | | CHEN Song | Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co.Ltd., Kunming 650106, China | |
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| 中文摘要: |
| AgCuInSn钎料作为一种典型的电真空钎料，具有理想的焊接温度、优良的润湿性能，但也存在脆性大、塑性差、加工困难的缺点，其制备方法一直是研究的重点和难点。分析了AgCuInSn钎料的优缺点，综述了该钎料的研究进展，还列举了AgCuInSn合金钎料的一般制备方法，并对该系列钎料的发展做出了展望。 |
| 英文摘要: |
| AgCuInSn solder, as a typical electric vacuum solder, has ideal soldering temperature and excellent wetting performance, but it also has the shortcomings of high brittleness, poor plasticity, and difficult processing. Its preparation method has always been a research key point and difficulties. This article analyzes the advantages and disadvantages of AgCuInSn solders, summarizes the research progress of the solders, and also lists the general preparation methods of AgCuInSn alloy solders, and prospects the development of this series of solders. |
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