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| 新型低温无铅焊料的研究进展 |
| Research progress of new low temperature lead-free solder |
| Received:July 30, 2021 |
| DOI： |
| 中文关键词: 低温无铅焊料 合金元素 组织性能 |
| 英文关键词: low temperature lead-free solder alloying elements organizational performance |
| 基金项目:国家重点研发计划(2017YFB0305700)；国家自然科学基金(NSFC-云南联合基金)(U1602271，U1602275)；云南省稀贵金属材料基因工程(202002AB080001-1)；“科技助力经济2020”国家重点项目 |
| Author Name | Affiliation | E-mail | | SHEN Bing-wei* | Kunming Insitute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co. Ltd., Kunming 650106, China | 2265489536@qq.com | | LIU Guo-hua* | Kunming Insitute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | GAO Qin-qin* | Kunming Insitute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | XIE Ming* | Kunming Insitute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | ZHANG Qiao* | Kunming Insitute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co. Ltd., Kunming 650106, China | | | DUAN Yun-zhao* | Kunming Insitute of Precious Metals, State Key Laboratory of Advanced Technologies forComprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co. Ltd., Kunming 650106, China | |
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| 中文摘要: |
| 随着人们对铅毒性的认知及世界各国“限铅令”的颁布，因为铅污染问题，研究人员开始着手研究Sn-Pb焊料的代替品，迫切需要探索一种零污染、低成本的新型电子封装焊料。目前研制的新型低温无铅焊料有Sn-Cu、Sn-Ag、Sn-Bi、Sn-Zn、Sn-In二元焊料和Sn-Ag-Cu三元焊料，但由于新型低温无铅焊料存在着熔点高、抗氧化性能差等问题，有人提出通过在这些无铅焊料中加入第三或第四种合金元素改善无铅焊料的组织性能。介绍了新型低温无铅焊料的应用，制备，优缺点及对它的要求，叙述了目前新型低温无铅焊料的研究进展，并提出了新型低温无铅焊料的研究方向。 |
| 英文摘要: |
| With the recognition of the toxicity of Pb and the issuance of the "Lead Limit Order" all over the world, researchers began to study the substitution of Sn-Pb solder because of Pb pollution. It is urgent to explore a new type of electronic packaging solder with zero pollution and low cost. At present, the new low temperature lead-free solder has Sn-Cu, Sn-Ag, Sn-Bi, Sn-Zn, Sn-In binary solder and Sn-Ag-Cu ternary solder, but because of the new low temperature lead-free solder has high melting point, poor oxidation resistance and other problems, It has been proposed to improve the microstructure of lead-free solders by adding a third or fourth alloying element to researchers. This paper introduces the application, preparation, advantages and disadvantages of the new type of low temperature lead-free solder, describes the current research progress of the new type of low temperature lead-free solder, and put forward the new type of low temperature lead-free solder research direction. |
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