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| 键合界面金属间化合物对可靠性影响的研究现状 |
| Research status of the influence of bonding interface intermetallic compounds on reliability |
| Received:April 28, 2022 |
| DOI： |
| 中文关键词: 键合丝 金属间化合物(IMC) 键合界面 可靠性 |
| 英文关键词: bonding wire intermetallic compound (IMC) bonding interface reliability |
| 基金项目:云南省重大科技专项 (202002AB080001-1)；昆明市科技计划项目(2019-1-G-25318000003398)；云南省重大科技计划(202102AB080008)；云南省科技人才与平台计划(202105AC160006)；昆明市高层次人才引进工程创新类技术先进项目；云南贵金属实验室科技计划项目(YPML-2022050202) |
| Author Name | Affiliation | | DU Wenjing | Kunming Institute of Precious Metals, Kunming 650106, China | | ZHOU Wenyan | Kunming Institute of Precious Metals, Kunming 650106, China
State key Laboratory of Advanced Technology of Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China | | PEI Hongying | State key Laboratory of Advanced Technology of Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China | | YANG Anheng | State key Laboratory of Advanced Technology of Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China | | WU Yongjin | State key Laboratory of Advanced Technology of Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China | | KONG Jianwen | State key Laboratory of Advanced Technology of Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China | | KANG Feifei | State key Laboratory of Advanced Technology of Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co.Ltd., Kunming 650106, China |
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| 中文摘要: |
| 在微电子封装过程中，键合丝被广泛应用，而键合可靠性对于产品的应用性能有着极大的影响，受到人们的广泛关注。键合丝与常用的铝焊盘之间是异质材料，在应用和服役的过程中会在界面上产生金属间化合物(IMC)，对器件可靠性产生影响，同时，键合强度也与键合丝和焊盘之间的界面反应联系密切，因此了解键合丝与铝焊盘之间金属间化合物的形成与演变对键合可靠性的影响是有必要的。本文综述了Au/Al、Ag/Al和Cu/Al三种键合界面上金属间化合物的形成与演变的研究现状，并根据目前的应用状况，展望了未来的应用发展前景。 |
| 英文摘要: |
| In the process of microelectronics packaging, bonding wires are widely used, and the bonding reliability has great impact on the application performance of final products. The bonding wires and the commonly used aluminium pads are heterogeneous with each other, and during application and service intermetallic compounds (IMC) can be generated at the interface, leading to negative effect on device reliability. Meanwhile the bonding strength is closely related to the interface reaction between the bonding wire and the pad. Therefore, it is necessary to understand how the formation and evolution of IMCs between bonding wires and aluminium pads affect the bonding reliability. This paper reviews the current state of research on the formation and evolution of intermetallic compounds at three bonding interfaces, Au/Al, Ag/Al and Cu/Al. Future developments in the light of current applications are also prospected. |
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