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| 不同剪切速率下锡银铜系/镍金焊点的断裂行为研究 |
| Fracture behavior of Sn-Ag-Cu solder joints on Ni(P)/Au surface-finished substrates at different shear rates |
| Received:October 26, 2022 |
| DOI： |
| 中文关键词: 高可靠无铅焊料 锡银铜系 镍金镀层 剪切速率 断裂模式 |
| 英文关键词: highly reliability lead-free solder Sn-Ag-Cu Ni(P)/Au surface-finished shear rate fracture mode |
| 基金项目:云南省重大科技专项(202002AB080001-2)；企业基础研究应用基础研究联合专项(202101BC070001-007) |
| Author Name | Affiliation | | WANG Jiajun | R&
D Center, Yunnan Tin Industry Group Holdings Co. Ltd., Kunming 650000, China | | CAI Shanshan | R&
D Center, Yunnan Tin Industry Group Holdings Co. Ltd., Kunming 650000, China | | LUO Xiaobin | R&
D Center, Yunnan Tin Industry Group Holdings Co. Ltd., Kunming 650000, China | | PENG Jubo | R&
D Center, Yunnan Tin Industry Group Holdings Co. Ltd., Kunming 650000, China |
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| 中文摘要: |
| 对锡银铜系高可靠性焊料合金的研究虽然已经较为广泛，但是缺乏对其焊点在不同应变速率下的剪切强度和断裂模式的研究。本文将牌号为SAC305和Innolot不同成分的锡银铜系焊料合金锡膏印刷在镍金镀层(Ni(P)/Au)上回流成BGA焊点，采用DAGE 4000 HS焊接强度测试仪进行不同剪切速率下的剪切性能测试，并对其剪切曲线、剪切强度及断裂能进行计算和分析，再采用金相显微镜和扫描电子显微镜(SEM)对焊点界面微观结构及断口进行表征分析。结果表明:合金本身成分的差异导致焊点界面金属间化合物层(IMC层)厚度和分布存在差异，随着剪切速率的增加，SAC305和Innolot合金焊点的强度总体上都随之增加，且焊点的断裂模式由焊点基体内部的韧性断裂向界面金属间化合物脆性断裂发生转变，Innolot合金由于其他金属元素添加导致的强化作用使得其剪切强度得到较大提升而塑性损伤。 |
| 英文摘要: |
| Although the research on Sn-Ag-Cu based high reliability solder alloy has been extensive, there is a lack of reports about the shear strength and fracture mode of the solder joints at different strain rates. In this research, the Sn-Ag-Cu solder pastes with different compositions, named SAC305 and Innolot, were printed on the Ni(P)/Au surface-finished substrates and reflowed to form BGA solder joints. The shear properties at different shear rates were tested using the DAGE 4000 HS bondtester, and the shear curves, shear strengths, and fracture energies were calculated and analyzed. The microstructure and fracture surface of the solder joint interface were characterized by metallographic microscope and scanning electron microscope (SEM). The results show that the difference in alloy compositions leads to a change in the thickness and distribution of the intermetallic compound layer at the solder joint interface. With an increase of the shear rate, the shear strengths of SAC305 and Innolot alloy solder joints increase accordingly in general, and the fracture mode of the solder joints shifts from the ductile fracture in the solder joint matrix to the brittle fracture of the intermetallic compound at the interface. Due to the strengthening effect caused by the addition of alloy elements, the shear strength of Innolot alloy is greatly improved, giving rise to the plastic damage. |
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