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| 铜-氨-硫代硫酸盐体系金溶出影响因素的电化学研究 |
| Electrochemical study on the factors affecting the dissolution of gold in the copper-ammonia-thiosulfate system |
| Received:November 02, 2022 |
| DOI： |
| 中文关键词: 硫代硫酸盐 浸金 交流阻抗 电化学 溶出 |
| 英文关键词: thiosulfate gold leaching AC impedance electrochemistry dissolution effect |
| 基金项目:云南省教育厅(2021J1374,2021J1378)；云南开放大学科研基金(21YNOU03) |
| Author Name | Affiliation | | XIANG Pengzhi | Faculty of Land Resource Engineering, Kunming University of Science and Technology, Kunming 650093, China
School of Chemical Engineering, Yunnan Open University, Kunming 650023, China | | ZHANG Ya | Yunnan Academy of Traditional Chinese Medicine, Kunming 650021, China | | DENG Feiyu | Wuhua Branch of Kunming Bureau of Ecology and Environment, Kunming 650030, China | | LIU Qiong | School of Chemical Engineering, Yunnan Open University, Kunming 650023, China | | DENG Chao | School of Chemical Engineering, Yunnan Open University, Kunming 650023, China | | YE Guohua | Faculty of Land Resource Engineering, Kunming University of Science and Technology, Kunming 650093, China |
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| 中文摘要: |
| 铜-氨-硫代硫酸盐浸金体系中，金的溶出本质上是电化学过程。采用交流阻抗和Tafel曲线分析硫代硫酸盐、铜离子、氨浓度对金的溶出影响。结果表明:在金的溶出过程中，硫代硫酸盐和铜离子可能会导致钝化，尤其使铜离子浓度增大会导致钝化加剧，这种钝化会交替出现；氨水不会导致钝化；对金溶出速率的影响，硫代硫酸盐最大，铜离子最为复杂，氨影响相对最小。 |
| 英文摘要: |
| The dissolution of gold in copper-ammonia-thiosulfate leaching system is essentially an electrochemical process. In this paper, AC impedance and Tafel curves were used to analyze the influence of thiosulfate, copper ion and ammonia concentration on the dissolution of gold. The results show that thiosulfate and copper ions may cause passivation during the leaching process of gold. Especially when the concentration of copper ions increases, the passivation will occur alternately. However, ammonia does not lead to passivation. As for the dissolution rate of gold, the effect of thiosulfate is the largest but copper exerts the most complext inflenence. |
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