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| 低温烧结高导热纳米银纸的制备及其烧结工艺研究 |
| Study on preparation and sintering process of silver nanowire film with a high thermal conductivity |
| Received:September 20, 2022 |
| DOI： |
| 中文关键词: 电子封装 热界面材料 低温烧结 高导热 |
| 英文关键词: electronic packaging thermal interface material low-temperature sintering high thermal conductivity |
| 基金项目:国防科技大学自主科研项目(22-TDRCJH-02-052) |
| Author Name | Affiliation | | YE Yicong | College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China | | PENG Yongqian | College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China | | YU Cuijuan | College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China | | WANG Zhen | College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China | | NI Ziqi | College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China | | XU Yuanxi | College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China | | DU Yongguo | College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China |
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| 中文摘要: |
| 制备了一种用于大功率半导体封装互连用的低温烧结高导热新型热界面材料—纳米银纸。其外观为可裁剪的纸张状，测量其抗拉强度为3.89 MPa。纳米银纸主要由银纳米线组成，银含量约为99.5%，其余为聚乙烯吡咯烷酮(PVP)为主的有机物。实验采用热压烧结方式，探究了不同烧结工艺对纳米银纸导热性能的影响。研究结果表明，纳米银纸可在200 ℃、10 MPa时实现烧结，并取得210 W?m-1?K-1的热导率(λ)，升高烧结温度和压力至300 ℃、10 MPa则能进一步将纳米银纸烧结体的热导率提升至280 W?m-1?K-1。纳米银纸可为大功率半导体封装互连提供一种优选方案。 |
| 英文摘要: |
| Silver nanowire film, a thermal interface material for connecting in the high-power semiconductor package, was successfully prepared by the hot pressing sintering techique. In appearance, the silver nanowire film was a cuttable sheet with a tensile strength of 3.89 MPa and was composed of 99.5% silver in nanowire arrays and 0.5% organic substances dominated by polyvinylpyrrolidone (PVP). Effects of the hot pressing sintering process on the thermal conductivity of the material was also investigated. The results showed that the silver nanowire film could be sintered at 200 ℃ and under 10 MPa, and a thermal conductivity of 210 W?m-1?K-1 was obtained. Increasing the sintering temperature and pressure to 300 ℃ and 10 MPa could further raise the thermal conductivity of the silver nanowire film to a level of 280 W?m-1?K-1. |
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