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| Au-20Sn贵金属钎料箔材的制备及性能研究 |
| Study on preparation and properties of Au-20Sn precious metal soldering foil |
| Received:July 17, 2023 |
| DOI： |
| 中文关键词: Au-20Sn 钎料箔材 多层复合 性能研究 |
| 英文关键词: Au-20Sn soldering foil multi-layer method properities research |
| 基金项目:云南贵金属实验室科技计划项目(YPML-2022050204)；云南省重点研发计划项目(202303AA080001) |
| Author Name | Affiliation | | WANG Chunqin | Yunnan Precious Metals Laboratory Co.Ltd., Kunming 650106, China
Kunming Guiyan New Materials Technology Co.Ltd., Kunming 650106, China | | FU Quan | Yunnan Precious Metals Laboratory Co.Ltd., Kunming 650106, China | | ZHANG Lingyan | Kunming Guiyan New Materials Technology Co.Ltd., Kunming 650106, China | | ZHANG Anqiang | Kunming Guiyan New Materials Technology Co.Ltd., Kunming 650106, China | | YU Kun | Kunming Guiyan New Materials Technology Co.Ltd., Kunming 650106, China | | SONG Wei | Yunnan Precious Metals Laboratory Co.Ltd., Kunming 650106, China | | LUO Jingran | Kunming Guiyan New Materials Technology Co.Ltd., Kunming 650106, China | | LIU Yi | Yunnan Precious Metals Laboratory Co.Ltd., Kunming 650106, China
Kunming Guiyan New Materials Technology Co.Ltd., Kunming 650106, China |
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| 中文摘要: |
| 采用多层复合及扩散合金化工艺制备Au-20Sn贵金属钎料箔材，研究箔材的化学成分、熔化特性、力学性能、物相组成、组织形貌和微区成分，并采用真空钎焊工艺对所制备钎料箔材的钎焊性能进行研究。结果表明，采用多层复合及扩散合金化工艺制备的Au-20Sn钎料箔材脆性明显改善，能够在室温下冷冲裁加工成特定尺寸的预成型焊片；钎料箔材的化学成分和杂质含量符合设计要求，显微组织由连续且均匀分布的(AuSn)和(Au5Sn)两相组成；钎料熔程仅为3.1 ℃，在铜基材上润湿性和铺展性良好，钎焊铜接头力学性能较好。 |
| 英文摘要: |
| Amulti-layer composite method and subsequent heat treatment process were used to prepare Au-20Sn, a precious metal-based foil for soldering. The chemical composition, melting point, mechanical properties, phase composition, micro-structure and micro-composition were studied by the modern analytical methods while the soldering properties were evaluated by the vacuum soldering process. The results showed that the brittleness of multi-layer Au-20Sn foil prepared by multi-layer composite and diffusion alloying process was significantly improved, and it could be blanked at room temperature into a specific size for preformed soldering. The chemical composition and impurity content met the design requirements, and the microstructure consisted of continuous and uniformly distributed (AuSn) and (Au5Sn) phases. The melting range was only 3.1 ℃. The multi-layer Au-20Sn foil displayed good wettability and spreadability on the copper substrate. Moreover, the mechanical properties of copper joints soldered by Au-20Sn foil were excellent. |
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