Abstract
Cu含量对Ag/LSCO电接触材料物理性能的影响
Effect of Cu-doping content on the properties of Ag/LSCO electrical contact materials
Received:March 30, 2023  
DOI:
中文关键词: 电接触材料  Ag/LSCO  Cu改性  物理性能  润湿角
英文关键词: electrical contact material  Ag/LSCO  Cu modified  physical properties  wetting angle
基金项目:浙江大学科技创新合作专项 (桂科ZD20302002;桂科AB22036003)
Author NameAffiliation
WANG Dashuai College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014, China 
CAO Xudan School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China 
YANG Fang’er College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014, China 
ZHENG Xiaohua College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014, China 
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中文摘要:
      采用溶胶凝胶法辅以高能球磨工艺合成Cu粉体改性La0.5Sr0.5CoO3-δ(LSCO)粉体,用粉末冶金工艺结合热挤压技术制备了系列Cu改性Ag/LSCO电接触材料与成品丝,研究了Cu粉体对改性Ag/LSCO材料界面润湿性、物理力学性能等影响规律。结果表明,随着Cu含量的增加,改性Ag/LSCO-xCu (x=0、1、2、4、6、8)电接触材料的电阻率呈先增加后减小的趋势,与Ag和LSCO基底的润湿角变化趋势相一致,但其密度和硬度性能变化趋势相反;当Cu含量为4%时,Ag和LSCO-4Cu基底的润湿角达最小值55.0°,相应的成品丝(φ2.35 mm)性能最佳:电阻率2.29 μΩ.cm,硬度(HV0.3)946.7 MPa,密度9.73 g/cm3,断后延伸率3.9%,为纯Ag/LSCO的3.9倍。
英文摘要:
      La0.5Sr0.5CoO3-δ (LSCO) powder was synthesized by sol-gel method and subsequently modified with Cu powder via high-energy ball milling process, and from Cu-modified Ag/LSCO powder a series of electrical contact materials including sheets and wires were prepared by powder metallurgy process combined with hot extrusion technique. The influence of Cu content on the interfacial wettability, physical and mechanical properties of Ag/LSCO materials was explored. The results showed that with the increase of Cu content, the resistivity of the modified Ag/LSCO-xCu (x=0, 1, 2, 4, 6, 8) material presented a rising-declining change, consistent with trend in wetting angle changes between Ag and LSCO substrates. But for the change of density and hardness of Ag/LSCO-xCu, an opposite trend was observed. With a content of Cu at 4%, the wetting angle between Ag and LSCO-4Cu substrate reached a minimum value of 55.0°, and the modified Ag/LSCO wire (φ2.35 mm) displayed the best performance with the resistivity, hardness and density being 2.29 μΩ.cm, 946.7 MPa and 9.73 g/cm3, respectively. Moreover, its corresponding break elongation reached up to 3.9%, 3.9 times that of pure Ag/LSCO wire.
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