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| 基底类型对磁控溅射银薄膜的微观结构及电学性能的影响 |
| Influence of substrate types on the microstructure and electrical properties of Ag films deposited by magnetron sputtering |
| Received:December 28, 2023 |
| DOI： |
| 中文关键词: 磁控溅射 Ag薄膜 基底 微观结构 电学性能 |
| 英文关键词: magnetron sputtering Ag film substrate microstructure electrical property |
| 基金项目:云南贵金属实验室科技计划项目(YPML-2022050217)；云南(昆明)院士专家工作站项目(YSZJGZZ-2022015)；国家重点研发计划项目(2017YFB0305503)；云南省国际合作计划项目(2014IA037)；云南省创新团队项目(2019HC024) |
| Author Name | Affiliation | | LIU Yanbing | School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, China | | WEN Ming | Yunnan Precious Metals Laboratory Co.Ltd., Sino-Platinum Metals Co.Ltd., Kunming 650106, China | | CHAO Yunxiu | Yunnan Precious Metals Laboratory Co.Ltd., Sino-Platinum Metals Co.Ltd., Kunming 650106, China | | LI Sixie | Yunnan Precious Metals Laboratory Co.Ltd., Sino-Platinum Metals Co.Ltd., Kunming 650106, China |
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| 中文摘要: |
| 银在高性能薄膜材料领域被广泛地应用。通过在非晶态石英玻璃和(100)取向单晶本征硅片基底上分别溅射沉积金属银薄膜，探究了溅射基底对所镀薄膜结构和性能的影响规律。采用掠入射X射线衍射(GIXRD)、原子力显微镜(AFM)及场发射扫描电子显微镜(FESEM)表征了银薄膜的微观结构及表面形貌，采用四探针测试仪对薄膜电学性能进行了测试。结果表明，随溅射时间增加，两种基底上的薄膜择优取向变化趋势、薄膜膜厚、表面粗糙度、沉积速率、颗粒尺寸等微观结构及电学性能并未存在明显差异。但薄膜生长择优取向会受到基底类型及取向影响，在非晶态基底上的薄膜更倾向于Ag(111)面择优取向。银薄膜表面颗粒尺寸随溅射过程的进行逐渐增大，在单晶硅片基底上还出现了颗粒团聚现象。银薄膜电学性能对应于薄膜形成过程中不同阶段的微观结构。 |
| 英文摘要: |
| Silver is widely used in the field of high-performance thin films. The effect of two substrate types, amorphous quartz glass and (100) oriented intrinsic monocrystalline silicon, on the microstructure and electrical properties of Ag films was investigated. The microstructure and surface morphology of Ag films were characterized by using grazing-incident X-ray diffraction (GIXRD), atomic force microscopy (AFM) and field emission scanning electron microscopy (FESEM). The electrical properties of Ag films were measured on a four-probe tester. The results show that with the sputtering time increased there are no significant differences in the microstructure and electrical properties of the films on the two substrates, such as the film thickness, surface roughness, deposition rate, particle size, etc. However, the preferred orientation of the films is affected by the type and orientation of the substrates, and the film on the amorphous substrate is more inclined to the Ag(111) plane. The particle size of Ag film surface increases gradually with sputtering process, and the particle agglomeration occurs on the substrate of monocrystalline silicon. The electrical properties of Ag films are related to the microstructure at different stages in the film forming process. |
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