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| 不同Ga含量AgCuGa钎料铸态组织与润湿性研究 |
| Study on the microstructure and wettability of AgCuGa brazing materials with different Ga contents |
| Received:February 28, 2024 |
| DOI： |
| 中文关键词: Ag-Cu-Ga钎料 显微组织 润湿性 热力学计算 |
| 英文关键词: Ag-Cu-Ga solder microscopic organization wettability thermodynamic calculations |
| 基金项目:云南省科技厅中央引导地方专项(202207AC110006)；云南贵金属实验室重点研发计划(YPML-2023050210) |
| Author Name | Affiliation | | YAN Shichen | Kunming Institute of Precious Metals, Kunming 650106, China | | WANG Xingyu | Sino-Platinum Functional Materials Yunnan Co.Ltd., Kunming 650106, China | | XU Yulai | Sino-Platinum Functional Materials Yunnan Co.Ltd., Kunming 650106, China | | TAN Zhilong | Kunming Institute of Precious Metals, Kunming 650106, China
Sino-Platinum Functional Materials Yunnan Co.Ltd., Kunming 650106, China | | LUO Xianhui | Sino-Platinum Functional Materials Yunnan Co.Ltd., Kunming 650106, China | | LI Liuyang | Kunming Institute of Precious Metals, Kunming 650106, China | | PENG Tao | Sino-Platinum Functional Materials Yunnan Co.Ltd., Kunming 650106, China |
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| 中文摘要: |
| 采用差示扫描量热法、X射线衍射、扫描电子显微镜等，研究了Ag-49Cu-xGa (x=5, 7, 10)钎料的熔流点、润湿性和铸态组织，并运用Miedema模型、Toop模型等对Ag-Cu-Ga三元合金体系进行了热力学计算与分析。结果表明，钎料中的Ga元素全部固溶于Ag基体和Cu基体中，且由于富Cu相中Ga元素的化学势较低，Ga元素更倾向于固溶于富Cu相中；随着Ga含量的增加，合金的固相线与液相线降低，固相线与液相线的差值变大；在810 ℃时，随着Ga含量的增加，Ag-Cu-Ga钎料对无氧铜和镍片表面的铺展面积增大、润湿角减小、铺展系数增大，润湿性得到了改善，Ag-49Cu-10Ga钎料在无氧铜和镍片上的润湿性最好；润湿性实验后的钎料边缘为枝晶组织，钎料中心区域粗大的近似圆形的富Cu相占比较大，且随着Ga含量的增加，钎料中心区域富Cu相占比与单个富Cu相平均面积均呈现增大趋势。 |
| 英文摘要: |
| Differential scanning calorimetry, X-ray diffraction, and scanning electron microscopy et al. have been employed to study the melting point, wettability, and microstructure of Ag-49Cu-xGa (x=5, 7, 10) brazing material. Thermodynamic calculations and analysis are also carried out using the Miedema model and the Toop model. The results indicate that, the Ga element in the brazing material is completely dissolved in the Ag matrix and Cu matrix, and due to the lower chemical potential of Ga element in the Cu rich phase, Ga element tends to be dissolved more in the Cu rich phase. With the increase of Ga content, both the solidus and liquidus of the alloy decrease, but the temperature difference between them increases. At 810 ℃, the spreading area of AgCuGa solder on the surface of oxygen free copper and nickel sheets increases, the wetting angle decreases, and the spreading coefficient increases with the increase of Ga content, so the wettability is improved. Ag-49Cu-10Ga has the best wettability on oxygen free copper and nickel sheets. After the wettability experiment, the edge of the brazing material is dendritic structure, and the proportion of coarse and approximately circular Cu rich phases in the central area of the brazing material is relatively large. With the increase of Ga content, the proportion of Cu rich phases in the central area of the brazing material and the average ar0ea of a single Cu rich phase show an increasing trend. |
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