|
| Cu、Ni镀层对SiC/Kovar合金钎焊接头微观组织及力学性能的影响 |
| Effect of different plated elements on microstructure and mechanical properties of SiC/kovar alloy brazed joints |
| Received:November 05, 2024 |
| DOI： |
| 中文关键词: SiC Kovar合金 AgCuTi钎料 化学镀 |
| 英文关键词: SiC Kovar alloy AgCuTi filler chemical plating |
| 基金项目:陕西省重点研发计划一般项目(2024GX-YBXM-352)；西安市重点产业链关键核心技术攻关项目(23LLRH0004). |
| Author Name | Affiliation | | JING Yuhao | School of Materials Science and Engineering, Chang’an University, Xi’an 710065, Chian | | JI Xiongshuai | School of Materials Science and Engineering, Chang’an University, Xi’an 710065, Chian | | WU Zihao | School of Materials Science and Engineering, Chang’an University, Xi’an 710065, Chian | | GUO Yajie | School of Materials Science and Engineering, Chang’an University, Xi’an 710065, Chian | | ZHANG Huafeng | SPIC Science and Technology Research Institute, Beijing 102209, Chian |
|
| Hits: 2 |
| Download times: 1 |
| 中文摘要: |
| 通过化学镀在SiC管表面分别制备镍层和铜层，对比研究了无镀层及两种镀层对AgCuTi钎料连接SiC-Kovar合金异质接头微观组织和力学性能的影响。结果表明，AgCuTi钎料在直接连接SiC和Kovar合金时界面反应层的厚度约为2.03 μm，其主要成分为Fe2Si+TiC+Ti5Si3+Ni2Si。在连接镀镍的SiC和Kovar合金时，镍层与SiC反应而使得Ni2Si过量生成，反应层厚度为2.82 μm。在连接镀铜的SiC和Kovar合金时，由于铜层限制了活性元素Ti向SiC基体的扩散，界面反应层厚度降低到1.68 μm。无镀层、镀镍、镀铜3种接头的剪切强度分别为25.4、33.3、37.7 MPa。镀镍虽可以阻挡钎料中Ti与SiC的直接接触，但受限于金属间化合物增多，使得接头强度降低；镀铜可以限制界面反应层中金属间化合物的增多，提高接头性能。 |
| 英文摘要: |
| In this study, nickel layer and copper layer were prepared on the surface of SiC tube, respectively, by using the electroless plating method, and the effects of the absence of coating and two kinds of plating on the microstructure and mechanical properties of SiC-Kovar alloy heterojunction connected by AgCuTi solder were investigated. The results show that the thickness of the interface reaction layer is about 2.03 μm with the main components being Fe2Si+TiC+Ti5Si3+Ni2Si, when AgCuTi solder is directly connected to SiC and Kovar alloys. When nickel-plated SiC and Kovar alloy are connected, nickel reacts with SiC to produce excessive Ni2Si, and the thickness of the reaction layer is 2.82 μm. When copper-plated SiC and Kovar alloy are connected, the thickness of the interface reaction layer is reduced to 1.68 μm, because the copper layer limits the diffusion of active element Ti into SiC matrix. The shear strength of the three joints is 25.4 MPa, 33.3 MPa and 37.7 MPa, respectively. Although the plated nickel can prevent the direct contact between Ti and SiC in the solder, this effect is limited by the increase of intermetallic compounds, resulting in a decrease in the strength of the joint. On the contrary, copper can suppress the formation of intermetallic compounds in the interface reaction layer and improve the performance of the joint. |
|
View Full Text
View/Add Comment Download reader |
| Close |
|
|
|